AnandTech analyzes DDR4 and beyond
Writing for AnandTech, Ian Cutress recently explained why DDR4 was first launched in the enthusiast space. “On the server side, any opportunity to use lower
March 11, 2019
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
iRunway report highlights seminal Rambus patents
A recent iRunway report on the semiconductor memory landscape ranked Rambus in the fourth position of the top ten seminal patent holders in DRAM technology.
March 11, 2019
Mobile DRAM industry valued at over $3.6 billion
DRAMeXchange, a division of TrendForce, recently confirmed worldwide mobile DRAM revenue of US$3.607 billion in the fourth quarter of 2014 – representing 27.8% of DRAM
March 11, 2019
From GDDR to HBM
A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard.
November 18, 2020
R+ DDR4/3 PHY developed on Samsung’s 28nm LPP process
Rambus has officially confirmed that its R+™ DDR4/3 PHY was developed using Samsung’s 28nm LPP process. “Our ongoing collaboration with Samsung has yielded a robust,
March 11, 2019
DDR4 deployment averts “thermal nightmare”
Writing for DataCenter Dynamics, Scott Fulton notes that recent benchmark results indicate DDR4 is at least partially, and perhaps wholly, responsible for performance gains in
March 11, 2019
