U.S. EMV Payments: PIN or Signature?
One of the longest ongoing discussions about EMV in the US is the card verification method (CVM) to authenticate EMV payments: PIN or signature?
March 11, 2019
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
From GDDR to HBM
A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard.
November 18, 2020
U.S. DoD eyes 3D printing
Writing for Military Embedded Systems, Editorial Director John McHale confirms 3D printing has made its way into the military embedded computing realm, with suppliers exploiting
December 14, 2018
How to choose the right smart card
Consider what the smart card will be used for… Some smart cards are suited to certain applications such as access, payment or transport ticketing. How
March 11, 2019
Will authentication evolve beyond the basics?
Writing for The Guardian, journalist Andy Meek questions if increasing cyber attacks ultimately mean the end of username and password security. “The username and password
March 11, 2019
R+ DDR4/3 PHY developed on Samsung’s 28nm LPP process
Rambus has officially confirmed that its R+™ DDR4/3 PHY was developed using Samsung’s 28nm LPP process. “Our ongoing collaboration with Samsung has yielded a robust,
March 11, 2019
