Earlier this week, Rambus confirmed that it had signed a broad patent license agreement with Western Digital Corporation.
According to Luc Seraphin, senior VP and general manager of the Memory and Interfaces division at Rambus, the agreement covers the use of patented Rambus memory technologies, including high-speed interfaces, memory architectures, resistive memory and security technologies, in Western Digital products through 2021.
The agreement, says Seraphin, also includes an additional 5-year extension option.
“With the enormous amount of information flowing through today’s data center applications, memory and interface technologies play a critical role to meet the increasing demands of higher bandwidth and lower latency needs,” he stated.
“The lines between non-volatile memory and DRAM have blurred as the increasing performance of traditional NAND Flash has driven the adoption of faster interface architectures. This agreement with Western Digital provides access to our patented memory technologies that address the challenging requirements of modern data centers.”
As Seraphin explains, the Rambus Memory and Interfaces division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets.
“Rambus-enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, as well as system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality,” he added.
It should be noted that the Rambus Memory and Interfaces division recently launched a High Bandwidth Memory PHY on GLOBALFOUNDRIES 14nm LPP and a 56G SerDes PHY on second-gen FinFET process technology.
Interested in learning more about products and services developed by the Rambus Memory and Interfaces division? You can check out our product page here.
