GDDR6 PHY Subsystem Example
The Rambus GDDR6 PHY will be fully compliant to the JEDEC GDDR6 (JESD250) standard, supporting up to 16 Gbps per pin, and is available on TSMC 7nm process. The GDDR6 interface supports 2 channels, each with 16 bits for a total data width of 32 bits. With Speeds up to 16 Gbps per pin the Rambus GDDR6 PHY will offer a maximum bandwidth of up to 64 GB/s. This PHY will be available in advanced FinFET nodes for leading-edge customer integration. The Rambus system-aware design methodology used for IP Cores delivers a customer focused experience with improved time-to-market and first-time-right quality. Rambus offers flexible delivery of IP cores and will work directly with the customer to provide a full system signal and power integrity analysis, creating an optimized chip layout. In the end, the customer receives a hard macro solution with a full suite of test software for quick turn-on, characterization and debug.
Supported by Micron Technology, SK Hynix and Samsung, GDDR6 SGRAM will feature a maximum data transfer rate of 16 Gbps, along with an operating voltage of 1.35V. GDDR6 offers higher densities compared to previous-generation graphics memory. In addition, GDDR6 doubles the speed (12–16 Gb/s) of GDDR5 and provides more than 5X the 3.2 Gb/s speed of DDR4. Although initially targeted at game consoles and PC graphics, the latest iteration of GDDR is expected to be deployed across multiple verticals, with Micron specifically highlighting the data center and automotive sector.
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