AI accelerators require high-performance memory IP to meet bandwidth, capacity and latency requirements. This session dives into Rambus IP solutions for HBM4, LPDDR5, and GDDR7, highlighting their role in powering next-gen AI silicon.
Memory IP for AI Accelerators: HBM4, LPDDR5, and GDDR7
How AI is Shaping the Memory Market
Join Rambus experts for a dynamic roundtable discussion on the latest trends in the memory market. Topics include AI-driven demand, enabling technologies, and the future of memory innovation across computing segments.
Memory Interface Chip Solutions for PC Clients and AI
AI is increasingly moving to the edge, and PC clients are evolving to support intelligent applications. This session showcases Rambus memory chip solutions optimized for client platforms, enabling responsive AI experiences with performant memory architectures.
Memory Interface Chip Solutions for Servers and AI in the Data Center
Explore Rambus memory chip solutions designed for server platforms and AI workloads in the data center. This session covers performance, power efficiency, and scalability features that meet the demands of next-generation AI training and inference environments.
35 Years of Memory Innovation for AI
In this keynote, Dr. Steve Woo reflects on the 35-year journey of Rambus and the evolution of memory technology that has culminated in today’s AI-driven computing landscape. From early innovations to modern high-bandwidth architectures, this session highlights how memory has become a foundational enabler of artificial intelligence.
HBM: Everything You Need to Know
Explore the power of High Bandwidth Memory (HBM) in modern computing. This blog breaks down HBM architecture, performance benefits, and its role in AI, HPC, and next-gen GPUs.
