Download this white paper to explore how DDR5 DIMMs address these emerging requirements, delivering significant advancements in data rate, density, power efficiency, and channel architecture over DDR4. It examines the role of DDR5 as the foundational memory layer in modern AI infrastructure, complementing heterogeneous compute architectures and supporting highly concurrent, data-driven workloads, while also outlining the key design considerations required to achieve reliable, high-performance operation in next-generation servers.
Papers
Securing the Software Defined Vehicle: How Rambus and Telechips Enable Safe, Scalable Automotive SoC
Automotive architectures are rapidly shifting from distributed ECUs to centralized, zonal computing models designed for the software-defined vehicle (SDV). As workloads such as AI-driven ADAS, digital cockpits, and OTA updates increase system complexity, automakers are consolidating functions onto high-performance SoCs, improving efficiency but raising new challenges in isolation and security. To address this, Telechips is developing scalable, heterogeneous SoC platforms with built-in, system-level security, including the hardware-based Root of Trust, the Rambus RT-648 incorporating an Arm Cortex-M33 processor enabling secure boot, robust key management, and trusted system operation.
Hardware Deployment for Secure AI Using Confidential Computing
AI’s fast evolution is producing autonomous systems that can operate with minimal human oversight, improve themselves and become effective at decision-making in complex environments. These developments require careful consideration of security and privacy. To limit the overhead performance impact (area, throughput, latency and power), hardware-based security solutions can be deployed using state-of-the-art silicon IP.
HBM4E Memory: Break Through to Greater Bandwidth
AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM4E-ready memory subsystem solution from Rambus.
MACsec Fundamentals
For end-to-end security of data and devices, data must be secured both when it as rest (stored on a connected device) and when it is in motion (communicated between connected devices). For data at rest, a hardware root of trust anchored in silicon provides that foundation upon which all device security is built. Similarly, MACsec security anchored in hardware at the foundational communication layer provides that basis of trust for data in motion.
Expanding Server Memory Capabilities with MRDIMM Technology
As per socket compute density increases, the amount of directly accessible, low-latency memory bandwidth and capacity to adequately feed data to the multiple cores needs to scale accordingly. Scaling memory bandwidth by increasing raw DRAM component bandwidth or by increasing the number of memory channels has challenges and is reaching limits. JEDEC has unveiled the development of a new DIMM technology called Multiplexed Rank Dual Inline Memory Modules (MRDIMM) to address the bandwidth challenge.
