PUFs are mixed-signal circuits which rely on variations unique to a specific chip to self-generate a digital “fingerprint.” Most PUFs require a “helper-data” image that is generated during the initial digitization process, also known as Enrollment. Leveraging the chip-unique transformation function of PUFs and encrypted helper data, an unclonable challenge-response mechanism can be implemented that can distinguish authentic chips from perfect adversarial clones.
HBM3 Memory: Break Through to Greater Bandwidth
AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM3-ready memory subsystem solution from Rambus.
CXL Memory Interconnect Initiative: Enabling a New Era of Data Center Architecture
In response to an exponential growth in data, the industry is on the threshold of a groundbreaking architectural shift that will fundamentally change the performance, efficiency and cost of data centers around the globe. Server architecture, which has remained largely unchanged for decades, is taking a revolutionary step forward to address the growing demand for data and the voracious performance requirements of advanced workloads.
Security Solutions for AI/ML
AI/ML is increasingly pervasive across all industries driven by a massive wave of digitization. Data, the raw material of AI/ML and Deep Learning algorithms, is available in enormous quantities from all aspects of business operations. AI/ML promises great gains in responsiveness and adaptability in an ever-changing technology landscape, and industries are enthusiastically responding to that appeal. Concurrently, the vast value creation of AI/ML make it an inviting target for adversaries who aim to compromise or steal. Learn about the attack vectors against AI/ML and solutions for safeguarding its assets.
MIPI Drives Performance for Next-Generation Displays
MIPI® Alliance technology has helped enable the dramatic growth of the mobile phone market. The function and capabilities of MIPI interface solutions have grown dramatically as well. MIPI DSI-2 SM has become the leading display interface across a growing range of products including smartphones, AR/VR, IoT appliances and ADAS/autonomous vehicles. As the application space has expanded, so too have the performance requirements. Learn how MIPI DSI-2 interface and VESA® DSC visually lossless compression technologies can meet the challenges of next-generation displays.
HBM2E Raises the Bar for Memory Bandwidth
AI/ML training capabilities are growing at a rate of 10X per year driving rapid improvements in every aspect of computing hardware and software. HBM2E memory is the ideal solution for the high bandwidth requirements of AI/ML training, but entails additional design considerations given its 2.5D architecture. Designers can realize the full benefits of HBM2E memory with the silicon-proven memory subsystem solution from Rambus.