MIPI® Alliance technology has helped enable the dramatic growth of the mobile phone market. The function and capabilities of MIPI interface solutions have grown dramatically as well. MIPI DSI-2SM has become the leading display interface across a growing range of products including smartphones, AR/VR, IoT appliances and ADAS/autonomous vehicles. As the application space has expanded, so too have the performance requirements. Learn how MIPI DSI-2 interface and VESA® DSC visually lossless compression technology can meet the challenges of next-generation displays.
Interface IP
Supercharging AI Inference with GDDR7
A rapid rise in the size and sophistication of AI inference models requires increasingly powerful AI accelerators and GPUs deployed in edge servers and client PCs. GDDR7 memory offers an attractive combination of bandwidth, capacity, latency and power for these accelerators and processors. The Rambus GDDR7 Memory Controller IP offers industry leading GDDR7 performance of up to 40 Gbps and 160 GB/s of available bandwidth per GDDR7 memory device.
Data Center Evolution: The Leap to 64 GT/s Signaling with PCI Express 6.1
The PCI Express® (PCIe®) interface is the critical backbone that moves data at high bandwidth and low latency between various compute nodes such as CPUs, GPUs, FPGAs, and workload-specific accelerators. With the torrid rise in bandwidth demands of advanced workloads such as AI/ML training, PCIe 6.1 jumps signaling to 64 GT/s with some of the biggest changes yet in the standard.
HBM3 and GDDR6: Memory Solutions for AI
AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3 and GDDR6 provide the high performance demanded by the next wave of AI applications.
Heterogenous Integration – Chiplets
Chiplets are a growing trend within the semiconductor industry. And to many, represent a paradigm change for chip designers and chip consumers alike. Rather than a traditional single piece of monolithic silicon with many functions and features, a chiplet contains one or a very limited set of functions and features. Multiple chiplets are then assembled into a MCM (multi-chiplet module). Chiplets can offer multiple advantages over monolithic silicon. Learn the advantage and challenges, along with recommendations for the industry’s successful deployment of heterogenous chiplets.
HBM3 Memory: Break Through to Greater Bandwidth
AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM3-ready memory subsystem solution from Rambus.
