Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

Home > Press Releases > Page 33

Recent Press Releases

Rambus to Exhibit and Speak at the Design Automation Conference (DAC)

May 30, 2014

SUNNYVALE, Calif. – May 30, 2014 Who: Rambus Inc. (NASDAQ:RMBS) Where: Design Automation Conference (DAC) Moscone Center San Francisco, Calif. 170 Market Street, San Jose, Calif. www.dac.com When: June 1 – 5, 2014 Rambus will take part in multiple talks at the Design Automation Conference (DAC) 2014, the premier conference for design and automation of electronic systems, discussing low-power, high-performance mobile memory systems. In addition, Rambus is exhibiting at DAC in the ARM Connected Community Pavilion (Booth #2001). For additional

Read More »

Cryptography Research to Keynote Secure Semiconductor Technology Workshop

May 21, 2014

SUNNYVALE, Calif. – May 21, 2014 Who: Cryptography Research, Inc., a division of Rambus (NASDAQ:RMBS) Where: Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS) Workshop Fairmont Hotel, Gold Room 170 Market Street, San Jose, Calif. https://www.src.org/program/grc/t3s/ When: May 22, 2014 Benjamin Jun, chief technology officer of Cryptography Research Inc., a division of Rambus, will deliver keynote remarks on May 22 at the Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS) workshop taking place in San Jose, California. The

Read More »

Rambus Joins JEDEC Committee to Advance Server Memory Systems

May 14, 2014

Intends to help improve power and performance in cloud and server-based memory environments SUNNYVALE, CALIF. — May 14, 2014 — Rambus Inc. (NASDAQ:RMBS) today announced it has joined JEDEC Committee 40 (JC-40), which focuses on standards and performance test criteria for integrated circuits in the fast-growing cloud and server-based memory environments. As part of this membership, Rambus will work with other memory technology leaders to help define new architectural directions in server memory that can improve power, performance, and cost

Read More »

Bell ID Appoints Michelle Lehouck as U.S. EMV Product Director

May 13, 2014

Bell ID is pleased to announce the appointment of Michelle Lehouck as EMV Product Director for its U.S. division. As the U.S. migration to EMV chip technology gains momentum, Michelle will be responsible for maintaining and expanding Bell ID’s EMV activity in the region by offering even greater on-the-ground support to the company’s expanding U.S. client base. Bell ID is a software company providing banks with lifecycle management solutions for EMV smart cards, their related applications and cryptographic keys. Its

Read More »

Achronix Announces PCI-SIG® Compliance for Hardened PCI Express on Speedster22i FPGAs

May 6, 2014

Santa Clara, Calif., May 6, 2014 – Achronix Semiconductor Corporation today announced that its 22nm Speedster22i devices have achieved PCI-SIG® compliance with the PCI Express® (PCIe®) 3.0 Specification for x8 lanes. The Speedster22i devices successfully passed the PCI-SIG Compliance and Interoperability Tests at the PCI-SIG workshop and are now included in the PCI-SIG integrators list. Based on Intel’s 22nm Tri-gate technology, Speedster22i devices are the only FPGAs shipping today that contain a wide range of embedded hard IP – including

Read More »

Rambus to Present Innovative Mobile Memory Technology at Linley Tech Mobile Conference 2014

April 30, 2014

Session will focus on advanced memory solutions in fast-growth mobile device markets Santa Clara, Calif. – April 30, 2014 Who: Rambus Inc. (NASDAQ: RMBS) Where: Linley Tech Mobile Conference 2014 Santa Clara, Calif When: April 30- May 1, 2014 At the Linley Tech Mobile Conference 2014, Rambus Director Ajay Jain will participate in a session demonstrating recent innovative mobile memory solutions for smartphones and tablets, targeting a mid-range market segment that continues to be among the fastest-growing in mobile computing.

Read More »

DINI Group Verifies Compatibility of Northwest Logic’s PCI Express Cores with Virtex-7 ASIC Prototyping Platforms

April 29, 2014

April 29, 2014 – Northwest Logic and DINI Group announced today that Northwest Logic’s PCI Express® (PCIe®) 3.0 solution, including the Expresso 3.0 Core (PCI Express 3.0 Controller Core) has been validated on DINI Group’s 1, 2, and 4-FPGA ASIC prototyping platforms. This validation was done with 4 lanes running at 5 Gbit/s SERDES rates. “DINI Group continues to use a variety of Northwest Logic cores to validate our ASIC prototyping platforms.” said Brian Poladian, Senior Engineer at Dini Group,

Read More »

Nevis Technologies shortlisted for Prestigious Award

April 29, 2014

April 2014 Nevis Technologies shortlisted for Prestigious Award – Rambus Ecebs and SPT joint venture partnership proves a hit – Nevis Technologies has been recognised for its innovative, collaborative approach in delivering the technology which drives the new Subway Smartcard, introduced in Glasgow recently. The joint venture company which is a partnership of Rambus Ecebs – the UK’s leading smart technology provider – and Strathclyde Partnership for Transport (SPT) – Scotland’s largest transport authority – has been shortlisted for the

Read More »

Rambus to Webcast Annual Meeting of Stockholders

April 21, 2014

SUNNYVALE, CALIFORNIA, UNITED STATES – 04/21/2011 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies, will webcast its 2011 Annual Meeting of Stockholders on Thursday, April 28, 2011 at 9:00 a.m. Pacific Time. The Rambus 2011 Annual Meeting of Stockholders will take place at the Sheraton Sunnyvale Hotel, 1100 N. Mathilda Avenue in Sunnyvale, California at 9:00 a.m. Pacific Time. The live webcast of the meeting can be accessed via the Investor Relations section of the Rambus

Read More »

Rambus Reports First Quarter Financial Results

April 21, 2014

Business and Financial Highlights Signed broad five-year agreement with Nanya Technology Corporation, resolving all outstanding disputes Lensless Smart Sensor technology highlighted as one of the best technologies at Mobile World Congress 2014 Generated quarterly revenue of $78.3 million; up 7% quarter-over-quarter and up 17% year-over-year First quarter GAAP diluted net income per share of $0.07 First quarter non-GAAP diluted net income per share of $0.17; up 21% quarter-over-quarter and up 89% year-over-year SUNNYVALE, Calif. – April 21, 2014 – Rambus

Read More »
Rambus logo