Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem
Highlights: Provides HBM3-ready memory subsystem solution consisting of fully-integrated PHY and digital controller Supports data rates up to 8.4 Gigabits per second (Gbps), enabling terabyte-scale bandwidth accelerators for artificial intelligence/machine learning (AI/ML) and high-performance computing (HPC) applications Leverages market-leading HBM2/2E experience and installed-base to speed implementation of customer designs using next-generation HBM3 memory SAN JOSE, Calif. – Aug. 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the