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Rambus Inc. Announces First Quarter 2006 Earnings Call

Los Altos, California, United States – 04/12/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies, will hold its quarterly conference call on April 19, 2006 at 2:00 p.m. Pacific Time to discuss financial results for the first quarter of 2006.

This call will be webcast and can be accessed via Rambus’ web site at http://investor.rambus.com. A replay will be available following the call on Rambus’ Investor Relations web site or for one week at the following numbers: (888) 203-1112 (domestic) or (719) 457-0820 (international) with ID# 8412297.

Shareholder questions may be submitted to Rambus in advance of the conference call for management to respond to commonly asked questions during the call. Please submit your questions before April 14, 2006 via the Investor Relations website at http://investor.rambus.com/.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges, enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.

Rambus Raises First Quarter Revenue Guidance

Los Altos, California, United States – 03/21/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, announced today that it has revised its first-quarter revenue expectation, raising the range to $45 to $48 million. This compares with the previous expectation of $41 to $43 million for the quarter ending March 31, 2006.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.

Safe Harbor Statement

This release contains forward-looking statements under the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on current expectations, estimates and projections about the Company’s industry, management’s beliefs, and certain assumptions made by the Company’s management. Actual results may differ materially. Our business generally is subject to a number of risks which are described more fully in our SEC filings including our 10-K and 10-Qs.

Fujitsu and Rambus Sign Patent License Agreement Covering Systems and Semiconductors

Los Altos, California, United States – 03/20/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, announced today it has signed a patent license agreement with Fujitsu Limited.

The agreement applies to both manufacture and sale and covers systems, semiconductors, and all other segments of Fujitsu’’s business, past and future, on a worldwide basis. Fujitsu’’s payment amounts will be based in part on the relative volume of DRAM that Fujitsu purchases from Rambus-licensed or unlicensed memory suppliers.

“”We are very pleased to reach this agreement with Fujitsu which marks our first system-level patent license and another important milestone in validating the contribution of our patented inventions,”” said Harold Hughes, president and chief executive officer at Rambus. “”Our goal remains to design the world’s fastest interface solutions enabling our industry-leading customers to bring world-class products to market.””

Since its founding in 1990, Rambus has focused on advancing electronic system performance through innovations in logic and memory interfaces, controller architectures, and system design. The result is a broad portfolio of innovations and patents that enables semiconductor manufacturers and system designers to achieve ever-increasing levels of functionality and performance, to lower system costs, to mitigate risk with silicon-proven designs, and to reduce time to market. For more information on Rambus’’ patent portfolio, please visit www.rambus.com/patents/.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus’ interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, California, with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.

Media Alert – Rambus to Showcase its High-Speed Chip Interface Technology and Customer Solutions at the Intel Developer Forum (IDF) 2006

San Francisco, California, United States – 03/07/2006

Who:  Rambus Inc. (Nasdaq:RMBS)

Where: Intel Developer Forum – Spring 2006

Booth # 609

Moscone Convention Center

San Francisco, CA. USA

When:March 7-9, 2006

At IDF Spring, Rambus will showcase its high-speed chip interface products, featuring demos and displays on:

  • Rambus’ XDR™ DRAM devices along with an example of the first product implementation of XDR DRAM, a Cell processor-based blade server from Mercury Computer Systems, Inc. using 1 gigabyte of XDR DRAM. The Mercury Dual Cell-Based Blade features two IBM Cell BE (Broadband Engine) processors directly mounted on the board and XDR memory. Scalable to seven blades in a 7U configuration, the Dual Cell-Based Blade is expected to provide up to 2.8 teraFLOPS of processing performance in a 7U form factor, and up to 16 teraFLOPS in a six-foot rack.
  • Rambus’ DDR technology performing memory transactions to and from a DDR2 device operating at 800Mbps (400MHz clock).
  • Rambus’ PCI Express* PHY and Digital Controller Core.
  • Rambus customer PLX Technology will demonstrate their PCI Express Switch PEX 8518 running video through a PCI Express based graphics card.

* PCI Express is a trademark of PCI-SIG. Brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.

Rambus to Present at Morgan Stanley Semiconductor & Systems Conference

Los Altos, California, United States – 03/01/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies, today announced that Harold Hughes, chief executive officer, will present at the Morgan Stanley Semiconductor & Systems Conference on March 8, 2006 at 9:30 a.m. PT.

This event will be available through a webcast and can be accessed at Rambus’ Investor Relations web site at http://investor.rambus.com/. The audio replay will be available on Rambus’ IR web site following the event.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Taiwan, and Japan. Additional information is available at www.rambus.com.

Enigma Semiconductor Licenses Rambus’ Advanced Backplane Technology

HybriCore switch architecture incorporates Rambus SmartDFE high-speed signaling conditioning technology

Los Altos, California, United States – 02/07/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces and Enigma Semiconductor, an emerging leader in networked communications technology, today announced that Enigma has licensed Rambus’ ABP (Advanced Backplane) high-speed serial link interconnect technology for integration into Enigma’s HybriCore™ switch architecture. The first chipset implementation of the HybriCore architecture with Rambus’ ABP serial link technology is expected to sample in mid-2006.

The license agreement provides Enigma access to Rambus’ 1-10Gbps serial link ABP interconnect technology suitable for both legacy and greenfield modular switching system applications. Designed for the development of next-generation 10 and 40Gbps enterprise, storage and data center networks, HybriCore is the first scalable switching architecture to deliver both cell and native packet switching across the system backplane.

The HybriCore implementation features Rambus’ latest innovation in high-speed signal conditioning, the SmartDFE™ (Decision Feedback Equalization) technology. SmartDFE is an intelligent equalization method that addresses the issue of varying frequency responses within different channels in the same system. Overcoming the limitations of traditional inverse frequency equalization, SmartDFE significantly improves signal integrity by observing the characteristics and recent history of the data transmission, and applying this knowledge to make intelligent data recovery decisions.

“Robust serial link technology is a highly specialized and crucial component of a complete, integrated switching solution,” said Rob Sturgill, president and CEO of Enigma Semiconductor.”Integrating Rambus” ABP technology into the HybriCore chipset provides a competitive edge for OEMs seeking to dramatically increase the speed and density of their next generation systems while providing a robust, flexible platform for low-risk development with advanced signaling technology.”

Rambus’ high-speed ABP technology implements dynamic adaptation algorithms to maintain the highest signal integrity over temperature and humidity variances — effects that become significant as data rates increase. The Rambus ABP solution offers reliable real-time link health monitoring through on-chip diagnostics, as well as advanced signal conditioning technologies such as reflection cancellation and dynamic adaptation algorithms.

“Next-generation ultrahigh-density networking systems employing HybriCore architecture demand the highest performance serial link technology.” said Kevin Donnelly, vice president of engineering for Rambus Inc.”HybriCore is a natural first implementation for the high-speed, flexible, and robust signaling capabilities that our ABP solution provides.”

The Rambus family of ABP SerDes consists of a wide range of cells supporting data rates ranging from 1-10Gbps and supports standards and popular data rates such as Gigabit Ethernet, XAUI, turbo-XAUI and “double XAUI.” Proven in advanced fabrication processes, Rambus’ serial link ABP technology and signal integrity analysis services help engineers shorten development cycles, increase system performance over challenging signal environments, and reduce time-to-market. More information on Rambus ABP solutions is available athttp://www.rambus.com/products/backplaneserdes.

About Enigma Semiconductor

Enigma Semiconductor is an emerging leader in chip-level 10 Gbps and 40 Gbps integrated switching solutions for next generation networking systems. The company’s unique architecture combined with its advances in component integration enable system developers to break new ground in system efficiency. A fabless semiconductor company headquartered in Santa Clara, Calif., with research and development in Copenhagen, Enigma Semiconductor is backed by key technology investors including InnovationsKapital, Northzone Ventures, Startupfactory, Techno Venture Management, and Vaekstfonden. Visit Enigma Semiconductor on the web at www.enigmasemi.com.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.

SmartDFE is a trademark and Rambus is a registered trademark of Rambus Inc. HybriCore is a trademark of Enigma Semiconductor. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.

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