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Mitigating DDoS attacks with secure IoT endpoints

The IoT is expected to comprise 20.8 billion devices by 2020, with Gartner estimating that 5.5 million new “things” went online daily during 2016. Nevertheless, as Forrester analysts emphasize, robust IoT security remains mired in the “creation phase” along with nascent interoperability standards.

Unsurprisingly, malware targeting IoT has matured considerably, with the number of attacks focusing on IoT devices multiplying in recent years. According to Symantec, lackluster security makes IoT devices a soft and appealing target for attackers.

Juniper Research says cybersecurity is at a “boiling point”

Analysts at Juniper Research say the number of connected IoT (Internet of Things) devices, sensors and actuators will exceed 46 billion by 2021. As the analysts note, the 200% increase (from 2016) is expected to be driven by a reduction in unit hardware costs that will likely approach the ‘magic’ $1 price point.

Juniper Research analysts also confirm that cybersecurity security is at a boiling point, with the threat landscape widening.

Securing mobile payments with biometrics

Sarah Clark of Mitek recently told Pymnts that biometrics are perceived by both consumers and financial institutions as an ideal enabler for securely validating mobile transactions.

“Based on the proliferation of mobile devices and the convenience these offer, Goode Intelligence predicts 1 billion customers will use biometrics to access banking services by 2017,” she explained.

“Furthermore, the accelerated rollout of biometric-enabled banking will virtually make biometrics accessible to anyone with a smartphone.”

Over the last 12 months, says Clark, financial institutions and payments companies have recently improved security, expanded their mobile offerings and rolled out digital commerce capabilities. This is expected to prompt changes in consumer payment behaviors, paving the way for more engaging and secure user journeys.

Optimizing data centers with DDR4 buffer chips

DDR4 memory delivers up to 1.5x performance improvement over DDR3, running at 2.4Gbps- 3.2 Gbps, while reducing power by 25% on the memory interface. However, the shift to higher speeds degrades electrical signal integrity, especially when multiple modules are added to a system. Consequently, achieving higher capacities at more advanced speeds has become quite challenging.

Let’s talk about mobile payments 2.0

André Stoorvogel, head of marketing at Rambus Bell ID, recently penned an article for FinTech about the future of mobile payments. As Stoorvogel emphasizes, providing consumers with a truly frictionless experience is the “holy grail” of the payments industry.

“This [experience] has already been achieved in-app with platforms such as Uber, but has yet to be translated in-store,” he explained.

Rambus joins GLOBALFOUNDRIES FDXcelerator Program

GLOBALFOUNDRIES recently announced the addition of eight new partners to its FDXcelerator Program, including Rambus, Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Sasken, Sonics and QuickLogic.

Rambus, along with the above-mentioned partners, are joining Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dreamchip and Encore Semi to provide a suite of services that will enable GLOBALFOUNDRIES customers to rapidly implement 22FDX® system-on-chip (SoC) designs in low-power applications spanning Internet-of-Things (IoT), mobile, RF connectivity and networking markets.

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