Director of Business Development
Technical Director
Director of Systems Architecture
Technical Director, Rambus
Vice President of Product Marketing
Senior Director of Product Marketing
Senior Principal Engineer Systems Architecture
Senior Product Marketing Manager
Technical Director of Systems Architecture
VP and GM, Rambus Security
Product Marketing Manager
Senior Director of Product Marketing
Senior Director of Product Marketing
Senior Principal Engineer Systems Architecture
Fellow and Distinguished Inventor, Rambus
Rambus Design Summit took place over two days, with day one focusing on memory & interface solutions, and day two on security solutions. Take a look at the agenda below – all times in Pacific Daylight Time (PDT).
Tackling advanced data center workloads requires ever increasing levels of memory bandwidth and capacity, as well as high-speed interconnects. Hear Rambus technology experts share their insights on future memory and interconnect requirements in the data center covering critical enabling technologies including DDR5, HBM3, PCIe 6.0, GDDR6, LPDDR5X, CXL, and MIPI/VESA video compression.
Time | Session |
---|---|
8:00am | Memory Systems for AI in the Data Center Speaker: Steven Woo, Fellow and Distinguished Inventor |
8:30am | CXL Technology: Revolutionizing the Data Center Speaker: Mark Orthodoxou, Vice President of Strategic Marketing |
8:50am | Innovations in CXL 3.0: Novel Device Types, Capabilities, and Interconnects Speaker: Danny Moore, Senior Product Marketing Manager |
9:10am | LPDDR5X: Delivering High Bandwidth and Power Efficiency Speaker: Vinitha Seevaratnam, Senior Product Marketing Manager |
9:30am | System Level Design Considerations for PCIe 6.0 Speaker: Lou Ternullo, Senior Director of Product Marketing |
10:00am | Leveraging VESA Video Compression & MIPI DSI-2 for High-Performance Displays Speakers: Simon Bussières, Director of Systems Architecture |
10:30am | Meeting the Needs of Generative AI Training with HBM3 Speaker: Frank Ferro, Senior Director of Product Marketing |
11:00am | Powering AI/ML Inference with GDDR6 Memory Speaker: Frank Ferro, Senior Director of Product Marketing |
12:00pm | What’s Next for DDR5 Memory? Speaker: John Eble, Vice President of Product Marketing |
12:30pm | High-Performance Memory: Ask Me Anything Speakers: Tim Messegee, Senior Director of Solutions Marketing |
Security anchored in hardware provides the foundation for protecting data and devices at all stages of the semiconductor lifecycle. Join Rambus Security experts as they share their insights on security threats facing the industry including those that will arise in the era of quantum computers. Learn how you can protect hardware and data at rest, in motion and in use with Root of Trust, MACsec, Inline Memory Encryption, and more.
Time | Session |
---|---|
8:00am | Emerging Security Challenges in Highly Interconnected Semiconductor Systems Speaker: Neeraj Paliwal, VP General Manager |
8:30am | Selecting the right Root of Trust HSM Design for Your Next Project Speaker: Bart Stevens, Senior Director of Product Marketing |
9:00am | Protecting Devices and Data in the Quantum Era Speakers: Gijs Willemse, Senior Director of Product Management |
9:30am | Hardware Security: Ask Me Anything Speaker: Tim Messegee, Senior Director of Solutions Marketing |
10:00am | Securing MCUs with SCA Protection in IoT Designs Speaker: Marcel Van Loon, Senior Principal Engineer Systems Architecture |
10:30am | Cybersecurity: A Top Priority for the Automotive Industry Speaker: Adiel Bahrouch, Director of Business Development |
11:00am | The Convergence of MACsec and IPsec in Data Center Silicon Designs Speaker: Maxim Demchenko, Technical Director |
11:30am | Inline Memory Encryption (IME) to Enable Confidential Computing for Data Center Designs Speaker: Ajay Kapoor, Senior Principal Engineer Systems Architecture |
12:00pm | Securing the Semiconductor Supply Chain with Silicon Provisioning and Cloud Key Management Speaker: Matt Orzen, Technical Director Systems Architecture |
Don’t miss out on the Rambus Design Summit!