New DDR4 RDIMM and LRDIMM Chipset Meets Growing Demands Of Big Data and Cloud Computing
SUNNYVALE, Calif. – August 17, 2015 – Rambus Inc. (NASDAQ:RMBS) today introduced the R+ DDR4 server memory chipset, RB26, for RDIMMs and LRDIMMs[i], delivering superior performance and capacity for both the enterprise and data center server markets. The first in a family of R+ chips, the RB26 is an enhanced, JEDEC-compliant memory module chipset designed to accelerate data-intensive applications, including real-time analytics, virtualization and in-memory computing, with increased speed, reliability and power-efficiency.
“At Rambus, we have a rich history of innovation and expertise in high-speed memory interface design – the introduction of this chipset is a natural progression that enables us to deliver maximum value to the industry,” said Dr. Ron Black, president and chief executive officer at Rambus. “Expanding our offer beyond IP into chips with standards-based offerings that feature leading-edge performance and advanced functionality amplifies our growth strategy and furthers our engagement with the market.”
According to the International Data Corporation’s (IDC) 2015 Worldwide DRAM Demand and Supply 1Q15–4Q16 and 2015–2019 analysis, which was led by Mario Morales, vice president of the semiconductors research program, the average DRAM capacity per server is projected to more than double in the next three years with penetration of DDR4 in the server market reaching 100 percent by 2019.
“Data centers and enterprise markets are under increased pressure to implement enhanced memory architectures that meet the capacity and bandwidth requirements to handle large amounts of complex data,” said Patrick Moorhead, president of Moor Insights & Strategy. “Rambus’ deep expertise in advanced memory designs makes them the newcomer to watch in the server memory chipset market.”
Features and Functionality
- JEDEC DDR4 Compliance: fully-compliant with the latest JEDEC DDR4 RCD and DB specifications at 2666 Mbps with built-in support for future data rates;
- Industry-leading Performance and Margin: advanced I/O programmability and power management techniques allow for broad compatibility and increased efficiency in critical server infrastructures; and
- Advanced Debug and Serviceability: integrated tools and added device flexibility provide a robust system while delivering ease-of-integration and enhanced testability for server OEMs.
RB26 is currently sampling to key potential customers and critical ecosystem partners. This chipset includes a roadmap with value-added features to support further improvements to system performance and reliability.
Rambus will be demonstrating its server DIMM chipset at the Intel Developer Forum, as a Gold Sponsor and participant in the DDR4 Community, happening August 18-20, 2015 at Moscone Center in San Francisco.
For more details about our R+ DDR4 Server DIMM Chipset, please visit rambus.com/dimmchipset.
About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
[i] Registered Dual Inline Memory Modules (RDIMMs) and Load Reduced Dual Inline Memory Modules (LRDIMMs)