At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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CXL 3.0 Controller
https://www.rambus.com/interface-ip/cxl/cxl3-controller/CXL 3.1 Controller Contact Us The Rambus Compute Express Link® (CXL®) 3.1 Controller is a parameterizable design for ASIC and FPGA implementations. It leverages the Rambus PCIe 6.1 Controller architecture for the CXL.io protocol and adds the CXL.cache and CXL.mem protocols specific to CXL. The controller exposes a native Tx/Rx user interface for CXL.io traffic […]
MEDIA ALERT: Rambus Demonstrates CXL Platform Development Kit at SC23
https://www.rambus.com/rambus-demonstrates-cxl-platform-development-kit-at-sc23/SAN JOSE, Calif. – November 13, 2023 What: Rambus Demonstrates CXL Platform Development Kit Enabling Memory Tiering for AI Infrastructure Who: Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider Where: Supercomputing 2023 (SC23) at the CXL Consortium Booth (Booth #1301) at the Colorado Convention Center in Denver, CO When: November 14 -16, […]
Rambus Reports Third Quarter 2023 Financial Results
https://www.rambus.com/third-quarter-2023-financial-results/Delivered strong Q3 results with revenue and earnings above the midpoint of guidance Generated $51.6 million in cash from operations and completed $100.0 million accelerated share repurchase program Completed the sale of the PHY IP business, strengthening focus on chips and digital IP Produced quarterly product revenue of $52.2 million driven by memory interface chips […]
Rambus HBM3 Controller IP Gives AI Training a New Boost
https://www.rambus.com/blogs/rambus-hbm3-controller-ip-gives-ai-training-a-new-boost/As AI continues to grow in reach and complexity, the unrelenting demand for more memory requires the constant advancement of high-performance memory IP solutions. We’re pleased to announce that our HBM3 Memory Controller now enables an industry-leading memory throughput of over 1.23 Terabytes per second (TB/s) for training recommender systems, generative AI and other compute-intensive […]
Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP
https://www.rambus.com/rambus-boosts-ai-performance-with-9-6-gbps-hbm3-memory-controller-ip/Highlights: Enhances Rambus high-performance memory IP portfolio for AI/ML and other advanced data center workloads Supports future evolution of HBM3 memory standard with up to 9.6 Gbps data rates Enables industry-leading memory throughput of over 1.2 TB/s SAN JOSE, Calif. – Oct. 25, 2023 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider […]
HBM3E Controller
https://www.rambus.com/interface-ip/hbm/hbm3-controller/HBM3E / HBM3 Controller IP Contact Us The Rambus HBM3E / HBM3 controller cores are designed for use in applications requiring high memory bandwidth and low latency including AI/ML, HPC, advanced data center workloads and graphics. Secure Site Login ContactProduct Brief The HBM3E Memory Subsystem HBM3E is a high-performance memory that features reduced power consumption […]
Rambus Joins Arm Total Design
https://www.rambus.com/blogs/rambus-joins-arm-total-design/Generative AI and other advanced workloads bring even greater urgency to accelerate the power of computing. Training models are scaling by an incredible 10X per year, with the largest now , and are showing no sign of slowing. At the same time, AI inference is pushing out from the data center to millions and ultimately […]
Memory Key to Enabling AI: A Recap of AI Hardware Summit
https://www.rambus.com/blogs/focus-on-memory-at-ai-hardware-summit/By Steven Woo, Rambus Fellow Last week, I had the pleasure of hosting a panel at the AI Hardware & Edge AI Summit on the topic of “Memory Challenges for Next-Generation AI/ML Computing.” I was joined by David Kanter of MLCommons, Brett Dodds of Microsoft, and Nuwan Jayasena of AMD, three accomplished experts that brought […]
Rambus Moderates Panel on “Memory Challenges for Next-Generation AI/ML Computing” at AI Hardware Summit
https://www.rambus.com/blogs/rambus-moderates-panel-on-memory-challenges-for-next-generation-ai-ml-computing-at-ai-hardware-summit/Dr. Steven Woo, distinguished inventor and fellow at Rambus will be moderating an upcoming panel at the AI Hardware Summit on Tuesday, September 12th, 2023 starting at 3:00pm PT at the Santa Clara Marriott. Memory continues to be a critical bottleneck for AI/ML systems, and keeping the processing pipeline in balance requires continued advances in […]
PCI Express 5 vs. 4: What’s New? [Everything You Need to Know]
https://www.rambus.com/blogs/pci-express-5-vs-4/Introduction What’s new about PCI Express 5 (PCIe 5)? The latest PCI Express standard, PCIe 5, represents a doubling of speed over the PCIe 4.0 specifications. We’re talking about 32 Gigatransfers per second (GT/s) vs. 16GT/s, with an aggregate x16 link duplex bandwidth of almost 128 Gigabytes per second (GB/s). This speed boost is needed […]
