At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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Controllers Newsletter – Q1 2020
https://www.rambus.com/controllers-newsletter-q1-2020/Looking Ahead to 2020 from Northwest Logic, now part of Rambus Northwest Logic is now part of Rambus Inc., a premier silicon IP and chip provider. We are now proud to offer comprehensive memory and SerDes IP solutions, including PHYs and controllers. We continue to offer standalone controllers, providing customers with the ability to get […]
HBM2E Controller Product Brief
https://go.rambus.com/hbm2-controller-product-brief#new_tabHBM is a high-performance memory that features reduced power consumption and a small form factor. It combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for high-performance computing applications. The Northwest Logic HBM2 Controller supports both HBM2 and […]
Enflame Technology Selects Rambus HBM2 Memory Subsystem Solution For Next-Generation AI Training Chip
https://www.rambus.com/enflame-technology-selects-rambus-hbm2-memory-subsystem-solution-for-next-generation-ai-training-chip/Highlights: Comprehensive HBM Gen 2 (HBM2) memory subsystem solution consisting of PHY and digital controller delivers high bandwidth and low latency with minimal form factor and power envelope HBM2 IP provides 2Tb/s of memory bandwidth, making it the perfect fit for Enflame Technology’s cloud AI training products Broad suite of supporting services simplifies 2.5D integration […]
Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
https://www.rambus.com/rambus-announces-portfolio-of-advanced-memory-and-serdes-phys-on-tsmc-n7-process/Highlights: GDDR6, HBM2, and 112G Long Reach (LR) interfaces designed for TSMC’s industry-leading N7 process technology expand Rambus’ leading-edge memory and SerDes PHY offerings Portfolio enables critical building blocks for next-generation data center, networking, wireless 5G, high-performance computing (HPC), advanced driver assistance systems (ADAS), artificial intelligence (AI) and machine learning (ML) applications SUNNYVALE, Calif. and […]
HBM2 or GDDR6?
https://www.rambus.com/blogs/hbm2-or-gddr6/Earlier this month, Semiconductor Engineering editor-in-chief Ed Sperling hosted an industry roundtable to discuss new DRAM options and considerations. Frank Ferro, our senior director of product management, represented Rambus, alongside participants from Cadence, Synopsys and Samsung Electronics. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » As Ferro points out, […]
Part 2: Steven Woo Explains GDDR6 – HBM2 Design Tradeoffs
https://www.rambus.com/blogs/part-2-steven-woo-explains-gddr6-hbm2-design-tradeoffs/In part one of this two-part series, Steven Woo, Rambus fellow and distinguished inventor, speaks with Ed Sperling of Semiconductor Engineering about the basic design tradeoffs between GDDR6 and HBM2. To illustrate the differences between the two memory types, Woo highlights a 256 gigabyte per second memory system built using either GDDR6 or HBM2. In […]
Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
https://www.rambus.com/rambus-completes-acquisition-of-northwest-logic-extending-leadership-in-interface-ip/Highlights: Digital controller IP complements existing portfolio of high-speed interface PHYs Expands solutions for automotive, data center, artificial intelligence (AI), machine learning (ML) and communications applications Combined offerings, including HBM2, GDDR6, DDR4 and PCI Express (PCIe), create one-stop-shop for SoC designers SUNNYVALE, Calif. – Aug. 27, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon […]
Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
https://www.rambus.com/rambus-completes-acquisition-of-northwest-logic/Highlights: Digital controller IP complements existing portfolio of high-speed interface PHYs Expands solutions for automotive, data center, artificial intelligence (AI), machine learning (ML) and communications applications Combined offerings, including HBM2, GDDR6, DDR4 and PCI Express (PCIe), create one-stop-shop for SoC designers SUNNYVALE, Calif. – Aug. 27, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon […]
Part 1: Steven Woo Explains GDDR6 – HBM2 Design Tradeoffs
https://www.rambus.com/blogs/part-1-steven-woo-explains-gddr6-hbm2-design-tradeoffs/Steven Woo, Rambus fellow and distinguished inventor, recently spoke with Ed Sperling of Semiconductor Engineering about designing systems with GDDR6 and HBM2. As Woo emphasizes, understanding engineering tradeoffs are an important part of deciding how to best match a system with the most appropriate memory. Read first our primer on: HBM2E Implementation & Selection – […]
Rambus to Acquire Northwest Logic, Extending Leadership in Interface IP
https://www.rambus.com/rambus_to_acquire_northwest_logic_extending_leadership_in_interface_ip/Highlights: Complementary product portfolio of PHYs and controllers further accelerates Rambus growth Expands solutions for data center, artificial intelligence (AI), machine learning (ML), communications and automotive applications Combined offerings, including HBM2, GDDR6, DDR4 and PCI Express (PCIe), create one-stop-shop for SoC designers SUNNYVALE, Calif. and HILLSBORO, Ore. – July 29, 2019 – Rambus Inc. (NASDAQ: […]
