At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 142 Results
2.5D/3D Packaging Solutions for AI and HPC
https://go.rambus.com/packaging-solutions-for-ai-and-hpc#new_tabFor AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
Memory Systems for AI: Part 2
https://www.rambus.com/blogs/memory-systems-for-ai-part-2/In part one of this series, we discussed how the world’s digital data is growing exponentially, doubling approximately every two years. In fact, there’s so much digital data in the world that artificial intelligence (AI) is practically the only way to begin to make sense of it all in a timely fashion. Insights gleaned from […]
Memory Systems for AI: Part 1
https://www.rambus.com/blogs/memory-systems-for-ai-part-1/Written by Steven Woo for Rambus Press There has been quite a lot of recent news about domain-specific processors that are being designed for the artificial intelligence (AI) market. Interestingly, many of the techniques used today in modern AI chips and applications have actually been around for several decades. However, neural networks didn’t really take […]
Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results
https://www.rambus.com/fourth-quarter-fiscal-year-2019-financial-results/Excellent quarter, exceeding expectations; GAAP revenue of $59.9 million; with licensing billings of $63.8 million, product revenue of $26.6 million, and contract and other revenue of $13.9 million Record Q4 and full-year revenue for both the Memory Interface Chips and Silicon IP businesses $35.4 million in cash provided by operating activities in Q4 and $128.5 […]
Controllers Newsletter – Q1 2020
https://www.rambus.com/controllers-newsletter-q1-2020/Looking Ahead to 2020 from Northwest Logic, now part of Rambus Northwest Logic is now part of Rambus Inc., a premier silicon IP and chip provider. We are now proud to offer comprehensive memory and SerDes IP solutions, including PHYs and controllers. We continue to offer standalone controllers, providing customers with the ability to get […]
Memory subsystem solution for next-generation AI training chip
https://www.electronicspecifier.com/products/memory/memory-subsystem-solution-for-next-generation-ai-training-chip#new_tabRambus has announced that Enflame (Suiyuan) Technology has selected Rambus HBM2 PHY and Memory Controller IP for its next-generation AI training chip. Rambus memory interface IP enables the development of high-performance, next-generation hardware for leading-edge AI applications.
HBM2E Controller Product Brief
https://go.rambus.com/hbm2-controller-product-brief#new_tabHBM is a high-performance memory that features reduced power consumption and a small form factor. It combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for high-performance computing applications. The Northwest Logic HBM2 Controller supports both HBM2 and […]
MIPI DSI-2 Controller Core
https://www.rambus.com/interface-ip/mipi/dsi2-controller/MIPI DSI-2 Controller Core Contact Us The Rambus MIPI DSI-2 controller core is optimized for high performance, low power and small size. The core is fully compliant with the DSI-2 standard and implements all three layers defined therein: Pixel to Byte Packing, Low Level Protocol, and Lane Management. Secure Site Login ContactProduct Brief MIPI DSI-2 […]
MIPI CSI-2 Controller Core
https://www.rambus.com/interface-ip/mipi/csi2-controller/MIPI CSI-2 Controller Core Contact Us The Rambus MIPI CSI-2 controller core is optimized for high performance, low power and small size. The core is fully compliant with the CSI-2 standard and implements all three layers defined therein: Pixel to Byte Packing, Low Level Protocol, and Lane Management. For automotive safety-critical applications, an ASIL-B version […]
Enflame Technology Selects Rambus HBM2 Memory Subsystem Solution For Next-Generation AI Training Chip
https://www.rambus.com/enflame-technology-selects-rambus-hbm2-memory-subsystem-solution-for-next-generation-ai-training-chip/Highlights: Comprehensive HBM Gen 2 (HBM2) memory subsystem solution consisting of PHY and digital controller delivers high bandwidth and low latency with minimal form factor and power envelope HBM2 IP provides 2Tb/s of memory bandwidth, making it the perfect fit for Enflame Technology’s cloud AI training products Broad suite of supporting services simplifies 2.5D integration […]
