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Found 3636 Results
DSI
https://www.rambus.com/chip-interface-ip-glossary/dsi/Display Serial Interface (DSI) is a high-speed serial interface standard developed by the MIPI Alliance for connecting processors to display modules in mobile and embedded systems. It is designed to reduce pin count, power consumption, and electromagnetic interference (EMI) while supporting high-resolution displays. DSI is widely used in smartphones, tablets, automotive displays, and other compact devices.
DisplayPort
https://www.rambus.com/chip-interface-ip-glossary/displayport/DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA) to transmit high-resolution video and audio from a source device (like a computer) to a display (such as a monitor). Unlike older standards like VGA or DVI, DisplayPort uses packetized data transmission similar to Ethernet, USB, and PCI Express, allowing for higher performance and scalability.
Design Failure Mode and Effects Analysis (DFMEA)
https://www.rambus.com/chip-interface-ip-glossary/dfmea/Design Failure Mode and Effects Analysis (DFMEA) is a structured risk management methodology used in semiconductor design to proactively identify potential failure modes in integrated circuits (ICs), assess their impact on system performance, and implement mitigation strategies before fabrication. It is especially critical in high-reliability applications such as automotive electronics, data centers, and secure communications.
Silicon IP for the Final Frontier
https://www.rambus.com/blogs/silicon-ip-for-the-final-frontier/Like their terrestrial counterparts, space-based systems benefit from the greater computing power achieved through semiconductor scaling. However, chips for spacecraft must be radiation hardened (RH) to operate in the rigors of space, and there is considerable time and effort required to develop and qualify rad-hardened devices on a given process node. The BAE Systems RH45® nanometer (nm) node has long been the go-to solution for space-based computing, but the industry is now on the verge of […]
DDR5 PMIC5030 Product Brief
https://go.rambus.com/pmic5030-product-brief#new_tabDownload the product brief to see the specifications and features of the Rambus DDR5 PMIC5030.
Data Bus Inversion (DBI)
https://www.rambus.com/chip-interface-ip-glossary/dbi/Data Bus Inversion (DBI) is a signal encoding technique used in high-speed digital interfaces to reduce power consumption and improve signal integrity. DBI works by inverting data bits when the number of logical transitions (from 0 to 1 or vice versa) exceeds a predefined threshold, typically half the bus width. A control signal indicates whether inversion has occurred, allowing the receiver to correctly interpret the data.
CSI-2 (Camera Serial Interface 2)
https://www.rambus.com/chip-interface-ip-glossary/csi-2/CSI-2, or Camera Serial Interface 2, is a high-speed serial interface standard developed by the MIPI Alliance for connecting cameras to host processors in mobile and embedded systems. It is widely used in smartphones, tablets, automotive systems, drones, and industrial vision applications.
Scaling AI Infrastructure with PCIe 7 and CXL 3
https://event.on24.com/wcc/r/5051048/9DDC583F5FEB476AB8DF5CF39F634FB7#new_tabInterconnect technologies are key to scaling AI workloads across data center infrastructure. Learn how PCIe 7 and CXL 3 enable high-speed, low-latency connectivity for memory expansion and composable architectures in AI systems.
Memory IP for AI Accelerators: HBM4, LPDDR5, and GDDR7
https://event.on24.com/wcc/r/5051047/1951C72D6ABB0828FD16915C7DFF5279#new_tabAI accelerators require high-performance memory IP to meet bandwidth, capacity and latency requirements. This session dives into Rambus IP solutions for HBM4, LPDDR5, and GDDR7, highlighting their role in powering next-gen AI silicon.
How AI is Shaping the Memory Market
https://event.on24.com/wcc/r/5051045/2BE50C4E73B38BBEF853AFA6D1778604#new_tabJoin Rambus experts for a dynamic roundtable discussion on the latest trends in the memory market. Topics include AI-driven demand, enabling technologies, and the future of memory innovation across computing segments.
