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Wearable technology was highlighted at CES 2015 last week in Las Vegas, with Intel CEO Brian Krzanich announcing the Curie module, a tiny hardware product based on the company’s first purpose-built system-on-chip (SoC) for wearable devices.
Wearable technology was highlighted at CES 2015 last week in Las Vegas, with Intel CEO Brian Krzanich announcing the Curie module, a tiny hardware product based on the company’s first purpose-built system-on-chip (SoC) for wearable devices. According to Gartner research director Annette Zimmermann, 30 percent of smart wearables will be completely unobtrusive to the eye […]
Did you know that a September 2015 US Office of Personnel Management (OPM) system breach resulted in 5.6 million leaked fingerprints? “We’ve all seen movies that included a clever way to get someone’s fingerprints, and I never thought much about it,” Jimmy Pike, an analyst Moor Insights & Strategy, wrote in Forbes. “Now a huge […]
SUNNYVALE, Calif. – January 8, 2015 – Rambus Inc. (Nasdaq: RMBS) today announced that Dr. Ronald Black, chief executive officer, and Satish Rishi, chief financial officer, will present at the Needham Growth Conference in New York on Tuesday, January 13, 2015. The presentation is scheduled to begin at 8:00 a.m. EST (5:00 a.m. PST) and […]
Unveiled earlier this week at CES 2015, the flagship Asus ZenFone 2 features a 64-bit Intel Atom Z3580 processor and supports up to 4GB LPDDR3 DRAM. Additional key ZenFone 2 specs include an Intel LTE-Advanced modem, 5.5-inch full HD IPS+ screen, 13MP PixelMaster rear camera, 5MP front camera and a 3000mAh battery.
Unveiled earlier this week at CES 2015, the flagship Asus ZenFone 2 features a 64-bit Intel Atom Z3580 processor and supports up to 4GB LPDDR3 DRAM. Image Credit: Asus Additional key ZenFone 2 specs include an Intel LTE-Advanced modem, 5.5-inch full HD IPS+ screen, 13MP PixelMaster rear camera, 5MP front camera and a 3000mAh battery. […]
Recently, Semiconductor Engineering interviewed Paul Kocher, president and chief scientist of the Rambus Cryptography Research division, about various security risks associated with the rapidly evolving Internet of Things (IoT).
In 2015, tokenization will take the headlines. This is being driven by the recent developments in HCE and Apple’s entry into mobile payments with Apple Pay.
Recently, Semiconductor Engineering interviewed Paul Kocher, president and chief scientist of the Rambus Cryptography Research division, about various security risks associated with the rapidly evolving Internet of Things (IoT). In part one of the interview, Kocher told the publication that the industry is still more concerned with making a chip work than securing it. “[This] […]
The Secure Content Storage Association (SCSA) has added 21 new members to its rapidly expanding ranks, including Sprint, Toshiba, Broadcom and Mstar Semiconductor. The latest SCSA contributors join an expansive group of 50 participating companies spanning the larger entertainment and technology industries. These include Qualcomm, Samsung, Comcast, LG Electronics, Cisco, Seagate, MediaTek, Marvell and Dolby […]
