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Mobile Payments: Why Secure Element in the Cloud? from
Learn why it makes economic sense to load EMV credentials in the cloud when offering mobile NFC payments to your customers.
SUNNYVALE, CALIFORNIA, UNITED STATES – 06/17/2013 — Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today announced it has signed a license agreement with STMicroelectronics (NYSE: STM). The agreement expands the ST relationship with CRI, furthering its adoption of DPA countermeasures into multimedia chipsets and accelerating its broad support for […]
June 2013 – New cards can provide unrivalled ITSO product storage capability Rambus Ecebs have been awarded ITSO certification for two members of its card family “Pearl” and “Diamond”. Pearl, a contactless only smart card can hold at least twice as many ITSO products as the contactless platform (DESFire) and is therefore capable of holding […]
New solution reduces the complexities and cost of delivering mobile NFC services Global provider of token management software, Bell ID, has launched Secure Element (SE) in the Cloud to simplify the provisioning of near-field-communication (NFC) based mobile services. The solution manages keys, certificates and NFC credentials in a secure remote environment rather than in the […]
Bringing clarity to the players involved in implementing EMV migration and NFC projects.
Immersive Mobile Media Platform to Reach 10 Million American Households SUNNYVALE, CALIFORNIA, UNITED STATES – 06/03/2013 – Rambus Inc. (NASDAQ: RMBS), the innovative technology solutions company that brings invention to market, today announced that Mnet America, a youth entertainment brand for all things Asian cool, has selected the Rambus Imerz Media Platform to create a […]
European Readiness for Mobile NFC Payments
SUNNYVALE, CALIFORNIA, UNITED STATES – 05/28/2013 Who: Rambus Inc. (NASDAQ: RMBS) Where: ECTC 2013 Cosmopolitan of Las Vegas Las Vegas, NV 89109 When: May 28-31, 2013 At the Electronic Components Technologies Conference (ECTC) 2013, the industry’s premier international packaging, components, and microelectronics systems technology conference, Rambus engineers and inventors will present three papers on 3D […]
U.S. Banks: insource or outsource EMV data preparation
