At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Found 3615 Results
LPDDR5 Delivers High Bandwidth for a Growing Range of Applications
https://www.rambus.com/lpddr5-delivers-high-bandwidth-for-a-growing-range-of-applications/Initially designed for mobile phones and laptops, the bandwidth and low power characteristics of LPDDR make it an increasingly attractive choice of memory for applications in IoT, automotive, edge computing and the data center. Fifth-generation LPDDR5 raises data rates to 6.4 Gbps and bandwidth to 25.6 GB/s for a x32 DRAM device. In this session, Rambus and its partners OpenFive and Avery Design Systems will discuss their high-performance, high-quality, configurable LPDDR5 solution.
Accelerating Data Interconnects with PCI Express™ 6.0 & 5.0 Interface IP
https://www.rambus.com/accelerating-data-interconnects-with-pci-express-6-0-5-0-interface-ip/The latest generation of the PCI Express, PCIe™ 6.0, advances performance to 64 GT/s in support of advanced workloads and networking. In this presentation, interface technology expert, Arjun Bangre will discuss the changes implemented in PCI Express 6.0, such as PAM4 signaling and low-latency forward error correction (FEC). In addition, Arjun Bangre will contrast PCIe 6.0 and 5.0 and explain how Rambus can support the PCIe interface your next design requires.
GDDR6 Memory Enables High-Performance Inferencing
https://www.rambus.com/gddr6-memory-enables-high-performance-inferencing/A rapid rise in the size and sophistication of inferencing models has necessitated increasingly powerful hardware deployed at the network edge and in the endpoint devices. To keep these inferencing processors and accelerators fed with data requires a state-of-the-art memory solution that delivers extremely high bandwidth. Frank Ferro will discuss the design and implementation considerations of GDDR6 memory subsystems to address the bandwidth needs of these next-generation inferencing engines.
Implementing CXL™ 2.0 Interconnect Solutions
https://www.rambus.com/implementing-cxl-2-0-interconnect-solutions/Compute Express Link™ (CXL) has evolved rapidly since its launch in 2019 and is slated for debut in the next generation of server platforms coming later this year. While it builds on the same physical layer as PCI Express, CXL implements unique features at the controller level to enable memory cache coherency between a host and multiple types of connected devices including smart NICs, accelerators and memory expansion devices.
Memory Bandwidth for AI/ML Races Higher with HBM3
https://www.rambus.com/memory-bandwidth-for-ai-ml-races-higher-with-hbm3/With the insatiable need for higher bandwidth in state-of-the-art AI/ML training and HPC, the HBM standard has been on a rapid pace of improvement. The newly standardized HBM3 generation doubles the data rate to 6.4 Gb/s that offers up to 819 GB/s of memory bandwidth between an accelerator and a single HBM3 DRAM device. Memory interface technology expert, Frank Ferro will discuss how the Rambus 8.4 Gb/s HBM3 Memory Subsystem can provide the headroom and scalability needed for implementing state-of-the-art HBM designs.
Advancing Computing in the Accelerator Age
https://www.rambus.com/advancing-computing-in-the-accelerator-age/Moore’s Law has been the force that has shaped the modern world enabling chips with billions of transistors. Yet today, when we need Moore’s Law more than ever, the rate of semiconductor scaling is slowing, requiring system architects to take a new approach to continue the pace of performance gains in computing. Heterogenous compute architectures with purpose-built silicon hold the key to the next great chapter of semiconductor industry as we enter the accelerator era.
Rambus RT-640 Road to ISO26262 Certification
https://go.rambus.com/rambus-rt-640-road-to-iso26262-certification#new_tabModern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This whitepaper details the process for how Rambus achieved the […]
CXL™ 3.0 Turns Up Scalability to 11
https://www.rambus.com/blogs/cxl-3-0-turns-up-scalability-to-11/The CXL™ Consortium (of which Rambus is a member) has now released the 3.0 specification of the Compute Express Link™ (CXL) standard. CXL 3.0 introduces compelling new features that promise to increase data center performance, scalability and TCO. CXL has evolved rapidly from its introduction in 2019. The 1.0/1.1 specification enabled prototyping of CXL solutions. […]
Rambus Appoints Desmond Lynch as Chief Financial Officer
https://www.rambus.com/rambus-appoints-desmond-lynch-as-chief-financial-officer/Brings over 20 years of finance and semiconductor experience SAN JOSE, Calif. – August 1, 2022 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has appointed Mr. Desmond Lynch to the position of senior vice president and chief financial officer. Mr. Lynch will be responsible for […]
Rambus Reports Second Quarter 2022 Financial Results
https://www.rambus.com/second-quarter-2022-financial-results/Delivered Q2 revenue and earnings at the high end of guidance Achieved record quarterly product revenue driven by memory interface chips Expanded DDR5 portfolio with introduction of companion chips for server and client memory modules Generated $56.5 million in cash from operations SAN JOSE, Calif. – August 1, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of […]
