K. Krishna Moorthy, Corporate VP and Managing Director at the Rambus India Design Center, has been appointed chairman of the India Electronics and Semiconductor Association (IESA).
Exploring 2.5D packaging and beyond
Frank Ferro, a Senior Director of Product Marketing at Rambus, recently participated in a Semiconductor Engineering roundtable discussion about 2.5D and advanced packaging. According to Ferro, 2.5D can succeed if customer demand overcomes the additional engineering costs associated with the packaging process.
Smart Building Sensors
Lensless Smart Sensor technology takes a novel approach to sensing by combining ultra-small diffractive gratings with standard image sensors. Light passing through the diffractive grating is intelligently spread onto the image sensor below to form an unrecognizable, but information-rich blob that contains all of the pertinent data from the scene. This information is combined with application-specific algorithms that can either visually reconstruct a scene, or extract relevant data, like the number and position of occupants directly from the blob. LSS uses the processed metadata to detect and interpret activity within a space at a size and performance previously unattainable with existing building sensing technologies, all without compromising privacy.
Through the use of diffractive optics, LSS captures information about a building’s occupants while fully preserving their privacy. The presence of someone, the number of people, and general activity can be passively detected, and used to trigger other systems and functions in the building.
LSS can also be deployed with thermal capabilities, so rooms can adjust automatically to the comfort level of occupants. Heating, cooling and lighting can be directed appropriately, and energy can be used only where needed. By rethinking the way digital systems see, LSS creates and intelligent infrastructure that can adapt to the ever-changing needs of a building’s occupants.
To learn more about Rambus Lensless Smart Sensors, click here.
IESA announces Executive Council for 2016-17
India Electronics and Semiconductor Association (IESA), the premier industry body representing the Indian Electronic System Design & Manufacturing (ESDM) industry today announced its new Executive Council for the year 2016-17. Mr K. Krishna Moorthy, Corporate VP and Managing Director, Rambus Chip Technologies (I) Pvt Ltd who was earlier the Vice Chairman for 2015-16, has taken over the role of Chairman for 2016-17. Mr. Ashwini K Aggarwal Director – Govt. Affairs, Applied Materials India Pvt. Ltd. would be the new Vice Chairman of IESA and Mr Anilkumar Muniswamy, Director, SLN Technologies Pvt. Ltd will serve as the new Treasurer.
Smart homes can’t always depend on the Internet
Jared Newman of FastCompany recently noted that buying into a smart home ecosystem is somewhat analogous to selecting a holy grail in the Temple of the Sun. Choose poorly, he says, and everything crumbles. “Maybe it’s time to devise a better way, one that doesn’t involve a round-trip to the Internet just to turn on your connected light bulbs,” he opined.
The system bottlenecks of Moore’s Law
Ed Sperling of Semiconductor Engineering recently noted that rightsizing chip architecture has become more complex in recent years. Essentially, rightsizing is a method of targeting chips to specific application needs – ensuring sufficient performance, while minimizing power and cost. “[Rightsizing] has been a topic of conversation across the semiconductor industry for years because as power becomes a bigger issue, improving the efficiency of designs by limiting the compute resources is a big opportunity,” he explained.
