Rambus

At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.

Home > Archives for [email protected] > Page 153

[email protected]

New York Times talks lensless smart sensors

Dave Gershgorn of the New York Times recently noted that the optics of the camera obscura have faithfully served photographers for ages. Indeed, the recipe has been kept fairly simple throughout the years: a lens, aperture, dark box and something to record the light.

“But the camera as we know it is changing,” Gershgorn confirmed. “A revolution in digital imaging research could surpass the camera obscura in almost every technical way: resolution, size and energy efficiency. It’s called computational photography, and it stems from the idea that if you can capture visual data instead of a true image, then the picture can be reconstructed with software.”

Rambus showcases lensless smart sensor prototypes @ PepCom 2016

Rambus will be showcasing a number of functional lensless smart sensor (LSS) prototypes at the CES 2016 PepCom Digital Experience tonight in Las Vegas. Developed in conjunction with frog design and IXDS, the prototypes include a drone (UAV), smartwatch as well as a maintenance and assembly platform.

Reimagining the future of smart manufacturing

Written by Dr. Patrick Gill, Rambus Principal Research Scientist

From its inception, the Internet has been revolutionary in the way it moves data. Let’s explore what makes the Internet so effective, and determine if we can implement a similar revolution for physical goods manufacturing.

Rambus Renews Patent License Agreement with Toshiba

New agreement expands collaboration between companies to include a broad range of memory and interface technologies

SUNNYVALE, Calif. – December 28, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced that it has renewed its patent license agreement with Toshiba Corporation. Under the terms of the new three-year agreement, Toshiba will be licensing a broad range of technologies from Rambus to cover products that include SoC’s with DRAM memory controllers and/or serial link interfaces, as well as Flash Memory and system products. Specific terms of this agreement are confidential.

“We are pleased to have expanded our relationship with Toshiba, one of the global leaders in the semiconductor industry,” said Luc Seraphin, senior vice president and general manager of the Memory and Interfaces Division at Rambus. “Toshiba has been a valuable customer of Rambus for more than a decade, and this renewal reinforces the value of our innovative technology and IP”.

Rambus develops enhanced, industry-compliant chipsets, custom memory and serial link technologies, and services to address power, performance, and capacity challenges for the mobile, connected device, and Big Data cloud computing markets. Rambus also drives innovations in silicon to cloud security and computational sensor technologies, making digital products safer and better.

For more details, please visit rambus.com

Follow Rambus

Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

Rambus renews patent license agreement with Toshiba

Rambus has renewed its patent license agreement with Toshiba Corporation.

As per the terms of the new three-year agreement, Toshiba will be licensing a wide range of technologies from Rambus to cover products that include SoCs with DRAM memory controllers and/or serial link interfaces, as well as Flash Memory and system products.

Optimizing memory for next-gen computing

Semiconductor Engineering Editor in Chief Ed Sperling recently noted that getting data in and out of memory is just as important as optimizing the speed and efficiency of a processor.

“[Nevertheless], for years design teams managed to skirt the issue because it was quicker, easier and less expensive to boost processor clock frequencies with a brute-force approach,” he explained. “That worked well enough prior to 90nm, and adding more cores at lower clock speeds filled the gap starting at 65nm.”

Rambus logo