Benjamin Jun’s presentation at the Featured Sessions Track of the 2006 RSA Conference.
Download “Attack of the Clones: Building Clone-Resistant Products – RSA 2006”
Rambus Announces Resignation of Chief Financial Officer
Robert Eulau leaving company to pursue another opportunity; search for replacement underway
Los Altos, California, United States – 02/07/2006
Rambus Inc. (Nasdaq:RMBS) today announced that Robert K. Eulau, senior vice president and chief financial officer, will resign from Rambus effective March 2, 2006 to pursue another opportunity. Harold Hughes, chief executive officer, will serve as interim CFO until a replacement has been found.
“Bob has made a significant contribution to Rambus for nearly five years and we are saddened to see him depart but wish him well in his new opportunity,” said Harold Hughes, president and chief executive officer at Rambus. “We will immediately begin a search for a new CFO who as part of the Rambus leadership team can continue the company’s track record of financial strength and solid growth.”
Mr. Eulau stated, “I am extremely grateful for the opportunities I have had over the last few years. Rambus has made great strides forward since 2001 and is very well positioned for the future.”
Eulau joined Rambus in May 2001. Prior to Rambus, he held various financial and marketing management positions during his sixteen years at Hewlett-Packard, most recently serving as vice president and CFO in the business customer organization.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Taiwan, and Japan. Additional information is available at www.rambus.com. Additional information is available at www.rambus.com.
Enigma Semiconductor Licenses Rambus’ Advanced Backplane Technology
HybriCore switch architecture incorporates Rambus SmartDFE high-speed signaling conditioning technology
Los Altos, California, United States – 02/07/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces and Enigma Semiconductor, an emerging leader in networked communications technology, today announced that Enigma has licensed Rambus’ ABP (Advanced Backplane) high-speed serial link interconnect technology for integration into Enigma’s HybriCore™ switch architecture. The first chipset implementation of the HybriCore architecture with Rambus’ ABP serial link technology is expected to sample in mid-2006.
The license agreement provides Enigma access to Rambus’ 1-10Gbps serial link ABP interconnect technology suitable for both legacy and greenfield modular switching system applications. Designed for the development of next-generation 10 and 40Gbps enterprise, storage and data center networks, HybriCore is the first scalable switching architecture to deliver both cell and native packet switching across the system backplane.
The HybriCore implementation features Rambus’ latest innovation in high-speed signal conditioning, the SmartDFE™ (Decision Feedback Equalization) technology. SmartDFE is an intelligent equalization method that addresses the issue of varying frequency responses within different channels in the same system. Overcoming the limitations of traditional inverse frequency equalization, SmartDFE significantly improves signal integrity by observing the characteristics and recent history of the data transmission, and applying this knowledge to make intelligent data recovery decisions.
“Robust serial link technology is a highly specialized and crucial component of a complete, integrated switching solution,” said Rob Sturgill, president and CEO of Enigma Semiconductor.”Integrating Rambus” ABP technology into the HybriCore chipset provides a competitive edge for OEMs seeking to dramatically increase the speed and density of their next generation systems while providing a robust, flexible platform for low-risk development with advanced signaling technology.”
Rambus’ high-speed ABP technology implements dynamic adaptation algorithms to maintain the highest signal integrity over temperature and humidity variances — effects that become significant as data rates increase. The Rambus ABP solution offers reliable real-time link health monitoring through on-chip diagnostics, as well as advanced signal conditioning technologies such as reflection cancellation and dynamic adaptation algorithms.
“Next-generation ultrahigh-density networking systems employing HybriCore architecture demand the highest performance serial link technology.” said Kevin Donnelly, vice president of engineering for Rambus Inc.”HybriCore is a natural first implementation for the high-speed, flexible, and robust signaling capabilities that our ABP solution provides.”
The Rambus family of ABP SerDes consists of a wide range of cells supporting data rates ranging from 1-10Gbps and supports standards and popular data rates such as Gigabit Ethernet, XAUI, turbo-XAUI and “double XAUI.” Proven in advanced fabrication processes, Rambus’ serial link ABP technology and signal integrity analysis services help engineers shorten development cycles, increase system performance over challenging signal environments, and reduce time-to-market. More information on Rambus ABP solutions is available athttp://www.rambus.com/products/backplaneserdes.
About Enigma Semiconductor
Enigma Semiconductor is an emerging leader in chip-level 10 Gbps and 40 Gbps integrated switching solutions for next generation networking systems. The company’s unique architecture combined with its advances in component integration enable system developers to break new ground in system efficiency. A fabless semiconductor company headquartered in Santa Clara, Calif., with research and development in Copenhagen, Enigma Semiconductor is backed by key technology investors including InnovationsKapital, Northzone Ventures, Startupfactory, Techno Venture Management, and Vaekstfonden. Visit Enigma Semiconductor on the web at www.enigmasemi.com.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.
SmartDFE is a trademark and Rambus is a registered trademark of Rambus Inc. HybriCore is a trademark of Enigma Semiconductor. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.
Rambus Chief Scientist Receives IEEE Donald O. Pederson Award In Solid-State Circuits
Los Altos, California, United States – 02/06/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced that its chief scientist, Dr. Mark Horowitz, has been recognized for his technical contribution by the IEEE Solid-State Circuits Society. In a ceremony today at the 2006 International Solid-State Circuits Conference (ISSSC), Dr. Horowitz received the Donald O. Pederson Award in Solid-State Circuits, for his pioneering contributions to the design of high-performance digital integrated circuits and systems.
The IEEE Donald O. Pederson Award in Solid-State Circuits was established in 1987 to honor an individual, or team of up to three, for outstanding contributions to solid-state circuits as exemplified by benefit to society, enhancement of technology, and professional leadership.
“Mark’s contributions to memory architecture and interface design are foundational in virtually all digital electronic devices on the market today,” said Harold Hughes, president and chief executive officer at Rambus. “We are greatly honored to have Mark lead our talented research staff as they push the boundaries of interface and system design bringing tremendous value to our customers and the market at large”
Dr. Horowitz is especially well-known for his pioneering research on high-speed, low-power CMOS data link interfaces for applications such as memory access in high-performance computing and signal-processing systems. Mark is currently a member of the IEEE Society and was named an IEEE Fellow in 2000. In 1990 he co-founded Rambus along with Dr. Mike Farmwald and was named chief scientist reporting to CEO Harold Hughes in May 2005.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com. Additional information is available at www.rambus.com.
About IEEE
IEEE is the world’s largest technical professional society. Through its 365,000 members in 150 countries, the society is a leading authority on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics. Dedicated to the advancement of technology, the IEEE publishes 30 percent of the world’s literature in the electrical and electronics engineering and computer science fields, and has developed more than 900 active industry standards. The organization also sponsors or co-sponsors more than 300 international technical conferences each year. Additional information is available at www.ieee.org.
Rambus Introduces New Innovative Decision Feedback Equalization Technology
SmartDFE™ achieves substantial cost savings and performance increase
Los Altos, California, United States – 02/06/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today introduced its latest innovation, SmartDFE™ (Decision Feedback Equalization) technology. Incorporated into Rambus’ advanced backplane (ABP) solution, SmartDFE enables substantial performance increase in high-speed data transmission with superior bit error rate margins when compared to standard equalization methods. ABP solutions with SmartDFE can reach performance levels of up to 7.5Gbps for upgraded systems and support legacy rates ranging from 1-6.4Gbps.
“To achieve considerable cost savings on the bill of materials for passive components, our SmartDFE technology was designed to enable the use of lower cost dielectric materials and connectors,” said Kevin Donnelly, vice president of engineering for Rambus Inc. “This is just one of the innovative approaches our engineering team has developed and constantly evaluates in an effort to help our customers obtain better value from their investment.”
SmartDFE technology addresses the issue of varying frequency responses within different channels in the same backplane. The technology significantly improves signal integrity by observing the characteristics and history of the data transmission and applying this knowledge to make intelligent data recovery decisions. This innovative approach does not affect the signal at the transmitter which leads to a reduction in cross-talk effects as well as a reduction in dispersion and attenuation. SmartDFE also takes advantage of the bitstream history at the receiver, making the technology backward compatible with legacy SerDes.
The Rambus family of ABP SerDes consists of a wide range of cells supporting data rates ranging from 1-10Gbps and support standards and popular data rates such as XAUI, turbo-XAUI and “double XAUI.” Proven in advanced fabrication processes, Rambus’ ABP technology and signal integrity analysis services help engineers shorten development cycles, increase system performance over challenging signal environments, and reduce time-to-market. More information on Rambus’ advanced backplane solutions is available at http://www.rambus.com/products/backplaneserdes.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.
SmartDFE is a trademark and Rambus is a registered trademark of Rambus Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.
Rambus Names Udo Muerle Director of Business Development for European Operation
Los Altos, California, United States – 01/30/2006
Rambus Inc. (Nasdaq:RMBS), one of the worlds premier technology licensing companies specializing in high-speed chip interfaces, today announced that Udo Muerle has been named Director of Business Development for its new European office. In this position, Mr. Muerle will report to Sharon Holt, Rambus Senior Vice President of Worldwide Sales, Licensing and Marketing. Mr. Muerle is responsible for the overall management and direction of Rambus” strategic customer and partnership relationships in Europe.
Mr. Muerle comes to Rambus from Synopsys, where he held the position of executive account manager. Prior to Synopsys, Mr. Muerle held various positions in the EDA industry, including that of chief executive officer of TransEDA, a leader in coverage and measurement verification for electronic designs. During his career, Mr. Muerle has also held positions in the European offices of Virage Logic, Texas Instruments and IBM. Mr. Muerle also served as communications officer in the German Army.
“As we grow our business presence in Europe, we are looking to Udo to build the foundation for strategic relationships with our customers there,” said Sharon Holt, senior vice president of worldwide sales, licensing and marketing at Rambus. “Europe is home to world-leading electronics companies and with Udos experience and background we look forward to engaging with them to develop breakthrough products for the market.”
Mr. Muerle holds a degree from Stuttgart University and currently lives outside of Stuttgart with his family.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.
