I don’t know about you, but when I hear the name Rambus, I think of the company that was founded in 1990. I remember them leaping into the limelight with a fanfare of trumpets. Well, if the truth be told, it was with their 600 MHz interface technology, which addressed the memory bottleneck issues being faced by system designers of the time, but hearing their sumptuous specifications was the computer engineering equivalent of having one’s ears massaged by a magnificence of mellophones.
5G and AI Raise Security Risks for IoT Devices
5G represents a revolution in mobile technology with performance that will rival that of wireline networks. 5G’s Ultra-reliable Low Latency Communication (uRLLC) links will enable a profusion of artificial intelligence (AI)-powered IoT devices from delivery drones to smart cities. The rapid rise in the number of smart IoT devices, coupled with expanded connectivity, will greatly escalate the growth of data and network traffic.
Dangers of Counterfeit Semi Chips
In 2019, the worldwide fake semi market was estimated at $75 billion according to Industry Week. This counterfeit chip market particularly prevalent in the government and defense industries. According to a US government report, more than 1 million counterfeit electronic components were used in 1,800 instances affecting military aircraft and missiles.
Rambus’ HBM2E Memory Controller & PHY Offer Chipmakers Cost-Effective Designs
The latest generation of high-bandwidth memory, HBM2E, is around the corner. Now that Samsung has started mass production of its HBM2E memory stacks, Rambus has unveiled its controller and PHY (physical interface) designs.
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they are also going to need an appropriate controller as well as physical interface. For many companies developing of such IP in-house does not make financial sense, so Rambus has designed a highly-integrated HBM2E solution for licensing.
2.5D/3D Packaging Solutions for AI and HPC
For AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
