Memory PHYs
5G connections to hit 1.4 billion by 2025
Juniper Research analysts are forecasting 1.4 billion 5G connections by 2025, an increase from just 1 million – upon commercial launch of 5th generation wireless
March 11, 2019
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Memory PHYs
Rambus and Northwest Logic certify HBM2 interoperability
Rambus has validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The combined HBM2 solution is designed to support high-performance networking
November 18, 2020
Memory PHYs
GLOBALFOUNDRIES highlights HBM2 PHY collaboration with Rambus
2Tbps multi-lane HBM2 PHY Earlier this month, GLOBALFOUNDRIES demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system
March 11, 2019
Memory PHYs
GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solution
GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs). According
March 11, 2019
Memory PHYs
Memory and the IoT
Semiconductor Engineering’s Ed Sperling and Jeff Dorsch recently wrote an article about the challenges of chip design in the age of the IoT. As Sperling
March 11, 2019
Memory PHYs
HBM2 continues to ramp
Samsung ramps volume production of 8GB HBM2 Earlier this month, Samsung confirmed an increase in production volume of its 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2)
March 11, 2019
