LOS ALTOS, CALIFORNIA, UNITED STATES – 04/13/2007
| Who: | Rambus Inc. (Nasdaq:RMBS) | |
| Where: | DATE 2007 Conference & Exhibition Booth # R16 Acropolis; Nice, France |
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| When: | April 17-19, 2007 | |
Join Rambus at DATE 2007 to hear about the latest technology developments in the areas of:
- Electronic system architecture optimization
- Custom solutions for inter-chip communication
- XDR™ memory architecture in the Sony PLAYSTATION®3
- Next-generation XDR memory technology for high-speed and cost-optimized applications
- PCI Express®* Gen 2: Complete solutions from concept to working system
- Low power optimization for multi-Gbps platforms
Rambus product demos include:
- XDR memory architecture
- DDR2 interface PHY
- PCI Express Gen2
- Low power optimized high-speed link running at 2.2 mW/Gbps
Rambus paper presentations include:
- “A New Technique for Characterization of Digital-To-Analog Converters in High-Speed Systems”
Tuesday, April 17, 2007; 5:45pm-6:00pm
- “Using the Cell Microprocessor as a Case Study to Demonstrate Design Techniques to Speedup Silicon Bring-up and In-System Characterization for Multi-Gigabit IO Signaling”
Wednesday, April 18, 2007; 11:00am-12:30pm
PCI Express is a registered trademark of the PCI Express Special Interest Group. The PCI-SIG is the special interest group that owns and manages PCI specifications as open industry standards.
XDR is a trademark of Rambus Inc. Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
