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Exploring 2.5D packaging and beyond
https://www.rambus.com/blogs/exploring-2-5d-packaging-and-beyond-2/Frank Ferro, a Senior Director of Product Marketing at Rambus, recently participated in a Semiconductor Engineering roundtable discussion about 2.5D and advanced packaging. According to Ferro, 2.5D can succeed if customer demand overcomes the additional engineering costs associated with the packaging process. “Back in the mobile days when we started seeing 3D packaging, it was […]
IESA announces Executive Council for 2016-17
http://www.thehindubusinessline.com/companies/iesa-announces-executive-council-for-201617/article8537171.ece#new_tabIndia Electronics and Semiconductor Association (IESA), the premier industry body representing the Indian Electronic System Design & Manufacturing (ESDM) industry today announced its new Executive Council for the year 2016-17. Mr K. Krishna Moorthy, Corporate VP and Managing Director, Rambus Chip Technologies (I) Pvt Ltd who was earlier the Vice Chairman for 2015-16, has taken […]
Smart homes can’t always depend on the Internet
https://www.rambus.com/blogs/smart-homes-cant-always-depend-on-the-internet-2/Jared Newman of FastCompany recently noted that buying into a smart home ecosystem is somewhat analogous to selecting a holy grail in the Temple of the Sun. Choose poorly, he says, and everything crumbles. “Maybe it’s time to devise a better way, one that doesn’t involve a round-trip to the Internet just to turn on […]
The system bottlenecks of Moore’s Law
https://www.rambus.com/blogs/the-system-bottlenecks-of-moores-law-2/Ed Sperling of Semiconductor Engineering recently noted that rightsizing chip architecture has become more complex in recent years. Essentially, rightsizing is a method of targeting chips to specific application needs – ensuring sufficient performance, while minimizing power and cost. “[Rightsizing] has been a topic of conversation across the semiconductor industry for years because as power […]
New Samsung HDR LED TVs go VIDITY
https://www.rambus.com/blogs/new-samsung-hdr-led-tvs-go-vidity-2/Samsung’s new KU6300 and KU6500 lineup of HDR LED TVs boast full support for VIDITY™, a secure delivery service that facilitates the purchase, delivery and storage of premium content across a wide range of devices. “Ranging in sizes from 40 to 65 inches, these four TVs have three HDMI inputs and two USB ports,” Explora’s […]
Rambus joins the RISC-V Foundation
https://www.rambus.com/blogs/rambus-joins-risc-v-foundation/Rambus has joined the RISC-V Foundation as a founding member. The organization is dedicated to managing and promoting the adoption of the RISC-V hardware architecture standard throughout the semiconductor market. With this announcement, Rambus joins a coalition comprising dozens of major industry players, including Google, Oracle, Western Digital and BAE Systems. “RISC-V is a perfect […]
Shifting gears for the IoT
https://www.rambus.com/blogs/shifting-gears-iot/Writing for Semiconductor Engineering, Ann Steffora Mutschler observes that a shift is currently underway in the automotive industry as more connected vehicles hit the road each year. “[Connectivity adds] many of the features that consumers now expect in mobile devices as well as some new ones that ultimately will lead to autonomous vehicles,” she explained. […]
SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems Announce New HBM White Paper: “Start Your HBM/2.5D Design Today”
https://www.rambus.com/new-hbm-white-paper/White paper explains a real, working HBM/2.5D supply chain San Jose, California — April 19, 2016 — SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have co-authored a white paper discussing High Bandwidth Memory (HBM) designs implemented with 2.5D technology. HBM is […]
Analysts bullish on IoT security
https://www.rambus.com/blogs/1558-2/ABI Research analysts say the burgeoning Internet of Things (IoT) will be the next big market for cyber security. “While it remains a fragmented market that has yet to consolidate, the ecosystem is expanding with vendors finding their way into three groups,” the researchers wrote in a recent blog post. “[These include] hardware (chipset/SoC/microcontroller), firmware/software […]
Rambus rolls out new version of DPA Workstation analysis platform
https://www.rambus.com/blogs/rambus-rolls-new-version-dpa-workstation-analysis-platform/Rambus’ Cryptography Research division has rolled out version 8 of its DPA Workstation (DPAWS) analysis platform. The latest iteration of DPAWS features an extensive upgrade to the workstation software and user interface (UI) for enhanced system performance and usability in ASIC and FPGA side-channel vulnerability testing. [youtube https://www.youtube.com/watch?v=MOMWmwjSlg4] According to Martin Scott, senior VP and […]
