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5G Mixes, Matches Memories


For consumers, 5G brings with it the potential of a better user experience on smartphones, but its influence on memory uptake won’t be at the device level. Handset makers will continue to add more DRAM and flash storage to smartphones regardless of network connections. The memory in 5G network infrastructure will be even more diverse given the […]

Rambus Demonstrates HBM2E Running at 4 Gbps: 512 GB/s per HBM2E Stack


Rambus has demonstrated that its HBM2E solution, which consists of a memory controller and a verified 1024-bit PHY, can operate at a whopping 4.0 Gbps data transfer rate per pin. The demonstration is meant to prove potential clients that the HBM2E solution can scale and offer a 25% higher peak bandwidth than is officially defined by JEDEC’s […]

Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications


Highlights:  Fully-integrated HBM2E memory interface solution, consisting of verified PHY and controller, achieves industry’s fastest performance New benchmark in performance supports accelerators requiring terabyte-scale bandwidth for artificial intelligence/machine learning (AI/ML) training applications Partners with SK hynix and Alchip to develop 2.5D HBM2E memory system solution using TSMC N7 process and CoWoS® advanced packaging technologies Offers unrivaled […]

Micron Reveals GDDR6X Details: The Future of Memory, or a Proprietary DRAM?


Micron Technology shared some additional details about its latest GDDR6X SGRAM used by Nvidia’s GeForce RTX 30-series graphics cards at a virtual briefing last week. The company revealed that it has experimented for more than a decade with technologies enabling the new type of memory and said that GDDR6X SGRAM had not been standardized by JEDEC yet. […]

Rambus and Micron Extend Patent License Agreement


SAN JOSE, Calif. – Sept 3, 2020 – Rambus Inc. (Nasdaq: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has extended its patent license agreement with Micron for an additional four years. The extension maintains the existing financial terms of the agreement and provides Micron with a […]

Micron Spills on GDDR6X: PAM4 Signaling For Higher Rates, Coming to NVIDIA’s RTX 3090


It would seem that Micron this morning has accidentally spilled the beans on the future of graphics card memory technologies – and outed one of NVIDIA’s next-generation RTX video cards in the process. In a technical brief that was posted to their website, dubbed “The Demand for Ultra-Bandwidth Solutions”, Micron detailed their portfolio of high-bandwidth […]

Rambus Reports Second Quarter 2020 Financial Results


Excellent quarter, at the high end of expectations for revenue and profit $62.0 million in cash provided by operating activities, the highest quarterly cash generation in over 10 years Fifth consecutive quarter of record revenue from memory interface chips driven by strong demand in data center SAN JOSE, Calif. – August 3, 2020 – Rambus […]

Greg Lang Joins Rambus Board of Directors


Proven technology executive brings 30 years of semiconductor industry leadership experience SUNNYVALE, Calif. — Jul. 30, 2020 — Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider dedicated to delivering data faster and safer, today announced the appointment of Greg Lang to its Board of Directors, effective immediately. Mr. Lang is a proven technology […]

Protecting against cybergeddon


Counterfeit chips, including gray market and rogue chips, have created an ongoing, multi-front battle for the semiconductor market to the tune of $75 billion annually, according to ResearchAndMarkets.com. The threat is more significant and broader than the chip maker’s bottom line. Counterfeit chips have numerous hidden dangers, including higher failure rates, corruption of data that can […]

Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center


Highlights: Expands comprehensive portfolio of cutting-edge IP designed on TSMC’s industry-leading 7nm (N7) process Enables the most power- and cost-efficient solution for die-to-die (D2D) and die-to-optical engine (D2OE) connectivity over Extra Short Reach (XSR) and Ultra Short Reach (USR) channels Accelerates next-generation data center, networking, 5G, high-performance computing (HPC), and artificial intelligence/machine learning (AI/ML) applications […]

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