Previously I shared that as a long-time Rambus employee, the Rambus of today isn’t the same company I joined 21 years ago. Even within just the past year the changes within Rambus are extraordinary. Not only have we settled all of our disputes from the past, but we have now become members of JEDEC. We recently joined JC-40, the committee that is working on developing standards that drive server-based memory solutions.
Moving Forward Through Collaboration
Rambus Joins JEDEC Committee to Advance Server Memory Systems
Intends to help improve power and performance in cloud and server-based memory environments
SUNNYVALE, CALIF. — May 14, 2014 — Rambus Inc. (NASDAQ:RMBS) today announced it has joined JEDEC Committee 40 (JC-40), which focuses on standards and performance test criteria for integrated circuits in the fast-growing cloud and server-based memory environments. As part of this membership, Rambus will work with other memory technology leaders to help define new architectural directions in server memory that can improve power, performance, and cost and drive greater market and platform growth across the industry.
“The need for memory systems to meet the increasing demands of the cloud is growing rapidly and we’re continually exploring new memory architectures that solve real world technology and business challenges,” said Kevin Donnelly, senior vice president and general manager of the Memory and Interface Division at Rambus. “JEDEC is a great place for discussions focusing on technology requirements that will drive greater performance for the industry at large.”
Future memory systems in servers and datacenters will depend on advanced signaling and application-specific optimization to accelerate the growing requirements for lower power and higher performance while managing the associated cost. By focusing on the development of standards, Rambus and its fellow committee members can work towards defining new architectures that support the strain that increasing amounts of data puts on current memory systems.
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
About JEDEC
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing nearly 300 member companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for free download from the JEDEC website. For more information, visit jedec.org.
View the Rambus and JEDEC FAQ to learn more.
Bell ID Appoints Michelle Lehouck as U.S. EMV Product Director
Bell ID is pleased to announce the appointment of Michelle Lehouck as EMV Product Director for its U.S. division. As the U.S. migration to EMV chip technology gains momentum, Michelle will be responsible for maintaining and expanding Bell ID’s EMV activity in the region by offering even greater on-the-ground support to the company’s expanding U.S. client base.
Bell ID is a software company providing banks with lifecycle management solutions for EMV smart cards, their related applications and cryptographic keys. Its solutions enable banks to manage and control any EMV token, such as contact and contactless cards as well as applications on near field communication (NFC) enabled mobile phones, once they have been issued.
Michelle joins Bell ID with over 15 years of industry knowledge gained with companies such as STMicroelectronics and CPI Card Group. With practical experience of migrating European banks to EMV chip payment technology, she brings with her significant expertise of all aspects of EMV market strategy. This includes understanding the impact of implementing EMV on a bank’s infrastructure as well as the critical success factors which need to be met when managing such a project.
“Michelle’s appointment comes at an important time for the U.S. marketplace,” comments Pat Curran, Executive Chairman at Bell ID. “Now that doubt surrounding the Durbin Amendment has gone, issuers are moving full-steam-ahead with EMV deployments and the market is turning to technology providers and consultants that have extensive experience of supporting migration projects. Michelle’s wealth of knowledge about regional U.S. requirements combined with her own and Bell ID’s EMV expertise, places our U.S. team in a strong position to offer unrivalled support to U.S. banks.”
Mobility as a Catalyst for Change
From the first time I attended an MLOVE ConFestival in 2010, through each subsequent event, I have been continually impressed with the quality of individuals that attend, the companies those individuals represent and the innovations they create. As a group, MLOVE attendees are passionate about invention and inventing “things.” They continuously question the techniques of today and challenge the methods of tomorrow. Collectively they combine the creativity, drive, and expertise of both entrepreneurial start-ups and established market leaders in a dynamic, yet intimate, environment.
Achronix Announces PCI-SIG® Compliance for Hardened PCI Express on Speedster22i FPGAs
Santa Clara, Calif., May 6, 2014 – Achronix Semiconductor Corporation today announced that its 22nm Speedster22i devices have achieved PCI-SIG® compliance with the PCI Express® (PCIe®) 3.0 Specification for x8 lanes. The Speedster22i devices successfully passed the PCI-SIG Compliance and Interoperability Tests at the PCI-SIG workshop and are now included in the PCI-SIG integrators list. Based on Intel’s 22nm Tri-gate technology, Speedster22i devices are the only FPGAs shipping today that contain a wide range of embedded hard IP – including PCI Express Gen3 with integrated DMA Engine, DDR3, 100G Ethernet and Interlaken.
Hardening key interface IP in the Speedster22i devices frees up a substantial portion of the programmable logic fabric, increasing the effective capacity of the FPGA and reducing the overall power consumption. Additionally the embedded hard IP in Speedster22i HD FPGAs eliminates the cost of purchasing, integrating, closing timing and testing the functions that are required when soft IP is used. The PCI Express logic cores used in Speedster22i devices support Gen 1, 2 and 3 in x1, x4 and x8 configurations and are supplied by Northwest Logic. Speedster22i HD devices are the only FPGAs with an integrated DMA engine hardened as part of the PCI Express core. This provides additional cost, performance and power advantages vs. a soft implementation.
“We embedded the Northwest Logic PCI Express IP because it is an industry-leading, silicon-proven solution,” said Steve Mensor, Vice President of Marketing at Achronix. “Our customers require fully proven functional solutions and that’s what we are delivering with the embedded IP in our 22nm Speedster22i devices.”
“Our PCI Express IP has been successfully deployed in hundreds of applications in both hard and soft implementations,” said Brian Daellenbach, President, Northwest Logic. “We are excited to see our IP play a role in the Speedster22i success story.”
The Speedster22i HD1000 and HD680 devices are shipping today and have the following embedded hard IP: PCIe Gen3 x8 controllers, DDR 2/3 controllers, 10/40/100G Ethernet controllers and 12x10G Interlaken controllers. A video demonstration of the Speedster22i hardened PCI Express IP is available at https://www.achronix.com/products/videos/pci-express-demo.html.
About Achronix Semiconductor Corporation
Achronix is a privately held fabless corporation based in Santa Clara, California. Achronix builds application targeted field programmable gate arrays (FPGAs) built on Intel’s (NASDAQ:INTC) process technology. Achronix ACE design tools include integrated support for Synopsys (NASDAQ:SNPS) Synplify Pro. Achronix has sales offices and representatives in the United States, Europe, and China, and has a research and design office in Bangalore, India. Find out more at https://www.achronix.com.
Achronix and Speedster are registered trademarks of Achronix Semiconductor Corporation.
All other brands, product names and marks are the property of their respective owners.
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