Press Releases Archives

Rambus Expands Family of CryptoManager Root of Trust Secure Silicon IP Cores

June 26, 2019

Highlights: Offers tailored configurations addressing the security needs of Internet of things (IoT), artificial intelligence (AI), machine learning (ML), cloud, government, military and automotive applications Employs fully programmable hardware-level security co-processor with the ability to adapt to a dynamic threat environment Purpose-built, complete security solution offers ease of integration into SoC designs Features FIPS 140-2 ready crypto module and accelerators and DPA resistant crypto cores; designed for automotive-specific configuration ISO-26262-2018 ASIL-D SUNNYVALE, Calif. – June 26, 2019 – Rambus Inc.

Achronix Chooses Rambus GDDR6 PHY IP for Next-Generation FPGA

June 4, 2019

Delivering best-in-class solutions for artificial intelligence and hardware acceleration applications SUNNYVALE, Calif – June 4, 2019 – Rambus Inc. (NASDAQ: RMBS) today announced that Achronix, a leader in FPGA-based hardware data acceleration devices and high-performance eFGPA IP, has selected the Rambus GDDR6 PHY for its next-generation Speedster7t FPGA family. Leveraging the top-end data rates delivered by the Rambus GDDR6 memory interface, the Speedster7t family is optimized for artificial intelligence (AI), machine learning (ML) and high-bandwidth data acceleration applications and workloads. Designed for performance

Rambus and Infineon Team Up to Bring Global Smart Card and Mobile Ticketing Offerings to Transport

May 29, 2019

End-to-end CIPURSE solution to extend worldwide reach, providing flexibility, innovation and security key to future mobility services SUNNYVALE, Calif. and Glasgow, UK – May 29, 2019 – Rambus Inc. (NASDAQ: RMBS), a technology leader in smart ticketing solutions for public transport, today announced a new strategic collaboration with Infineon Technologies AG, a global leader in semiconductor solutions, to jointly promote smart ticketing solutions for mobile and smart cards that will drive the next generation of mobility services worldwide. Both companies will

eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip

May 13, 2019

Chip facilitates continued support of the latest HBM technologies for eSilicon’s 2.5D FinFET ASICs SAN JOSE, Calif. — May 9, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a 7nm test chip to provide silicon validation of its physical interface (PHY) to support the new JEDEC standard JESD235B, referred to informally as high bandwidth memory (HBM) 2E and emerging low-latency HBM technology. The chip contains a

Rambus Reports First Quarter 2019 Financial Results

April 22, 2019

First quarter revenue and billings in line with expectations; GAAP revenue of $48.4 million, with royalty revenue of $24.8 million and licensing billings of $75.4 million $28.8 million in cash provided by operating activities DDR4 server DIMM chipset revenue up nearly 40% year-over-year, fueled by continued market share growth Record revenue for IP Cores business; expanded portfolio with 32G PHY for 5G infrastructure and 112G LR PHY in 7nm for 400G and 800G networking SUNNYVALE, Calif. – April 22, 2019

Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers

April 16, 2019

SerDes PHY delivers leading-edge performance and power efficiency for next-generation SoCs in data-intensive applications Rambus 112G Long Reach SerDes PHY Rambus Modeled PAM-4 Signaling Transmit Eye SUNNYVALE, Calif. – April 16, 2019 – Today Rambus Inc. (NASDAQ: RMBS) announced its newest portfolio solution of 112G Long Reach (LR) SerDes PHY on a leading-edge 7nm process node for next-generation terabit switches, routers, optical transport networks (OTNs), and high-performance networking equipment. As the industry rapidly transitions to 400GB and 800GB wired communication applications, 112G is

Rambus and GLOBALFOUNDRIES to Deliver High-Speed SerDes on 22FDX® for Communications and 5G Applications

February 20, 2019

32G PHY will deliver power efficiency and performance for next-generation wireline and wireless infrastructure SUNNYVALE, Calif. – February 20, 2019 – Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of 32G Multi-protocol SerDes PHY on GLOBALFOUNDRIES 22nm FD-SOI (22FDX®) platform for high-volume, high-performance applications. Designed to meet the performance requirements of high-speed wireline, wireless 5G infrastructure and data center applications, the SerDes PHY delivers data rates up to 32 Gbps and supports multiple standards including

Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology

January 30, 2019

Leading IP to support TSMC’s customers with AI, HPC, automotive and networking applications SUNNYVALE and SANTA CLARA, Calif. – Jan. 30, 2019 – Rambus Inc. (NASDAQ: RMBS) today announced the tapeout of its GDDR6 PHY on TSMC 7nm FinFET process technology and is available from Rambus for licensing today. Leveraging almost 30 years of high-speed interface design expertise and using advanced process technology, Rambus has successfully taped out a GDDR6 PHY IP on TSMC 7nm process technology. With ongoing engagements among design and verification customers,

Rambus and Worldline Widen Collaboration in UK Rail

January 29, 2019

Partner to deliver ITSO smart tickets on-train and at stations SUNNYVALE, CA and London, UK – January 29, 2019 – Rambus Inc. (NASDAQ: RMBS), a global leader in smart ticketing, and Worldline, a European market leader in payments and transactional services, today announced the expansion of their collaboration to deliver innovation into UK rail. With the integration of Rambus remote ticket download (RTD) software, Worldline can now deliver ITSO-based smart tickets to customer smartcards with their @Station and Mobile Ticket Issuing Service (MTIS),

Rambus Reports Fourth Quarter and Fiscal Year 2018 Financial Results

January 28, 2019

Fourth quarter GAAP revenue of $68.5 million; revenue under ASC 605 would have been $102.0 million, in line with expectations; $35.1 million in cash provided by operating activities Record product revenue in 2018 for IP cores and server DIMM chips with wins at Tier 1 customers in data center and communications segments worldwide CryptoManager platform selected to securely provision Authenta™ secure memory product line at Micron SUNNYVALE, Calif. – January 28, 2019 – Rambus Inc. (NASDAQ:RMBS) today reported financial results

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