• Skip to primary navigation
  • Skip to main content
  • Skip to footer
  • English
  • Investor Relations
  • Resource Library
  • Newsroom
  • Blog
  • Careers
  • Support Center
Rambus Logo

Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

  • Products
      • All
          • Memory Interface Chips
          • DIMM Chipsets
          • DDR5 DIMM Chipset
          • DDR4 NVRCD
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • CXL Memory Interconnect Initiative
          • Interface IP
          • Memory PHYs
          • GDDR6 PHY
          • HBM3 PHY
          • HBM2E PHY
          • DDR4 PHY
          • More…
          • SerDes PHYs
          • PCIe 6.0 PHY
          • PCIe 5.0 PHY
          • 32G C2C PHY
          • 32G PHY
          • 28G PHY
          • More…
          • Digital Controllers
          • Memory Controllers
          • CXL & PCI Express Controllers
          • MIPI Controllers
          • Video Compression and Forward Error Correction Cores
          • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
          • Inline Cipher Engines
          • Crypto Accelerator Cores
          • DPA Countermeasures
          • Software Protocols & Crypto Toolkits
          • Anti-Counterfeiting
          • Provisioning and Key Management
      • Memory Interface Chips
        • DIMM Chipsets
          • DDR5 DIMM Chipset
          • Non-Volatile DDR4 Registering Clock Driver
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • DDR3 Register Clock Driver
          • DDR3 Isolation Memory Buffer
        • CXL Memory Interconnect Initiative

        • Made for high speed, reliability and power efficiency, our DDR3, DDR4, and DDR5 DIMM chipsets deliver top-of-the-line performance and capacity for the next wave of computing systems. Learn more about our Memory Interface Chip solutions
      • Interface IP
          • Memory PHYs
            • GDDR6 PHY
            • HBM3 PHY
            • HBM2E PHY
            • DDR4 PHY
            • DDR4 Multi-modal PHY
            • DDR3 PHY
          • SerDes PHYs
            • PCIe 6.0 PHY
            • PCIe 5.0 PHY
            • PCIe 4.0 PHY
            • 32G C2C PHY
            • 32G PHY
            • 28G PHY
            • 16G PHY
            • 12G PHY
            • 6G PHY
          • Digital Controllers
            • HBM3 Controller
            • HBM2E Controller
            • GDDR6 Controller
            • LPDDR5 Controller
            • CXL 2.0 Controller
            • PCIe 6.0 Controller
            • PCIe 5.0 Controller
            • MIPI CSI-2/DSI-2 Controllers
            • Video Compression and Forward Error Correction Cores
            • More…

        • With their reduced power consumption and industry-leading data rates, our line-up of memory interface IP solutions support a broad range of industry standards with improved margin and flexibility. Learn more about our Interface IP solutions
      • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
            • MACsec Engines
            • IPsec, TLS, SSL Multi-Protocol Engines
            • High Speed Public Key Accelerator
          • Inline Cipher Engines
          • Crypto Accelerator Cores
            • DPA Resistant Cores
            • Basic Crypto Blocks
          • Anti-Counterfeiting
            • CryptoFirewall Cores
            • Circuit Camouflage Technology
          • DPA Countermeasures
            • DPA Resistant Cores
            • DPA Resistant Software Libraries
            • DPA Workstation Platform
          • Software Protocols & Crypto Toolkits
            • IPsec Toolkit
            • FIPs Cryptographic Libraries
            • MACsec Toolkit
            • IoT Security Framework
          • CryptoMedia
            • Content Protection Core
            • Content Protection Services
          • Provisioning and Key Management
            • CryptoManager Provisioning
            • CryptoManager Device Key Management

        • From chip-to-cloud-to-crowd, Rambus secure silicon IP helps protect the world’s most valuable resource: data. Securing electronic systems at their hardware foundation, our embedded security solutions span areas including root of trust, tamper resistance, content protection and trusted provisioning. Learn more about our Security IP offerings
  • Markets
      • AI & Machine Learning
        • Speed and Security for the Artificial Intelligence & Machine Learning Revolution
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Provisioning and Key Management
          • AI & Machine Learning
      • Automotive
        • Providing Performance & Security for the Connected Car
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • PKE Engine
          • MACsec Engines
          • Crypto Accelerator Cores
          • Provisioning and Key Management
          • Explore Automotive
      • Data Center
        • Optimizing capacity, connectivity and capability of the cloud
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • MACsec Engines
          • Software Protocols
          • Provisioning and Key Management
          • See Data Center
      • Edge
        • Catching a tidal wave of data
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Software Protocols
          • Discover Edge
      • Government
        • Securing Mission-critical Systems
          • Products
          • Root of Trust
          • Protocol Engines
          • Anti-Tamper Cores
          • Provisioning and Key Management
          • DPA Workstation Platform
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • See Government
      • IoT
        • Making IoT Data Safe & Fast
          • Products
          • Root of Trust
          • TLS Toolkits
          • Provisioning and Key Management
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Explore IoT
  • Resources
    • Inventions
    • Buying Guide
    • Resource Library
      • Webinars
      • Product Selector
  • About
      • Corporate Overview
      • Leadership
      • Inventors
      • Careers
      • Locations
      • Investor Relations
      • Newsroom
      • Blog
      • Events
      • Partnerships
      • Certifications
      • Corporate Responsibility
      • Contact
Home > Videos > eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip

eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip

Chip facilitates continued support of the latest HBM technologies for eSilicon’s 2.5D FinFET ASICs

SAN JOSE, Calif. — May 9, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a 7nm test chip to provide silicon validation of its physical interface (PHY) to support the new JEDEC standard JESD235B, referred to informally as high bandwidth memory (HBM) 2E and emerging low-latency HBM technology.  The chip contains a 7nm PHY from eSilicon and a controller from Northwest Logic.  This 7nm test chip, along with a previously taped out 7nm test chip will be part of a 2.5D test system to verify end-to-end support for the new HBM interfaces. The PHY design is a “combo” device that supports HBM2, HBM2E and the emerging low-latency HBM interface in one physical IP block.

When compared to HBM2, the HBM2E standard increases total capacity from 8GB to 16GB, bandwidth per pin from 2.4 Gb/s to 3.2 Gb/s and bandwidth per stack from 307.2 GB/s to 410 GB/s. Samsung Electronics announced the industry’s first HBM2E to deliver the 3.2 Gb/s per-pin transfer speed, at NVIDIA’s GPU Technology Conference in March.

Low latency HBM devices have been launched by Renesas Electronics. These devices leverage Renesas low latency memory technology to realize high random-access rate and small data granularity as well as high bandwidth for latency-sensitive applications.

“We are pleased to work with our partner, eSilicon, on the validation of our Controller for HBM2E and low latency applications,” said Brian Daellenbach, president of Northwest Logic. “This validation further strengthens our industry-leading HBM2 Controller solution.”

“HBM memory stacks are a critical component for many of our new FinFET-class 2.5D ASICs,” said Hugh Durdan, vice president, strategy and products at eSilicon. “We look forward to validating the performance and functionality of our combo PHY and Northwest Logic’s controller to support the latest HBM capabilities.”

Read our primer on:
HBM2E Implementation & Selection – The Ultimate Guide »

You can learn more about eSilicon’s 7nm IP platform here, or contact your eSilicon sales representative directly or via sales@esilicon.com. You can learn more about Northwest Logic’s HBM2 Controller Cores here.

Contacts:
Sally Slemons
eSilicon Corporation
sslemons@esilicon.com

Nanette Collins
Public Relations for eSilicon
nanette@nvc.com

About eSilicon:

eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

###

eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Footer

About

  • Corporate Overview
  • Leadership
  • Careers
  • Locations
  • Investor Relations
  • News
  • Corporate Responsibility

Products

  • Memory PHYs
  • SerDes PHYs
  • Digital Controllers
  • Server DIMM Chipsets
  • Root of Trust Solutions
  • Provisioning and Key Management
  • Protocol Engines
  • Crypto Accelerator Cores
  • Software Protocols
  • DPA Countermeasures
  • Anti-Counterfeiting
  • CryptoMedia

Markets

  • AI & Machine Learning
  • Automotive
  • Data Center
  • Edge
  • Government
  • IoT
  • Pay TV

Resources

  • Resource Library
  • Webinars
  • Inventions
  • Buying Guide
  • Contact

Copyright © 2023 Rambus.com. All Rights Reserved. Privacy Policy | Trademark & Guidelines

  • Facebook icon
  • Twitter icon
  • YouTuve icon
  • LinkedIn icon
  • Blog icon