Recent Press Releases

Cubic extends ITSO capability in London transport network with new Rambus Ecebs deal

September 2013   Rambus Ecebs signs two year contract extension to provide its Paragon HOPS system in Capital HOPS system could handle over 10 million transactions per day, paving the way for future commercial ticketing schemes to connect to Oyster in London Cubic Transportation Systems and Rambus Ecebs have extended their commercial agreement to supply ITSO-based smart ticketing functionality in the London transport network by a further two years. Rambus Ecebs, the UK’s leading smart transport technology company, provides its

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Distinguished Scientist Dr. David Stork to Present on Computational Imaging and Sensing at SENSORCOMM 2013

SUNNYVALE, CALIFORNIA, UNITED STATES – 08/23/2013   Who: Rambus Inc. (NASDAQ:RMBS) Where: SENSORCOMM 2013 Novotel Barcelona Sant Joan Despi Carrer de la TV3, 2 Barcelona, Spain When: August 25-31, 2013   Dr. David Stork, Distinguished Research Scientist at Rambus, will deliver the plenary keynote at SENSORCOMM 2013. In his keynote speech, Dr. Stork will discuss Rambus’ findings on ultra-miniature lensless CMOS computational imagers and sensors. SENSORCOMM 2013 serves as a forum for researchers from academia and industry, professionals, standard developers,

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Rambus Completes Upsized Bond Offering

Raises $138 million through upsize and over-allotment options SUNNYVALE, CALIFORNIA, UNITED STATES – 08/19/2013 — Rambus Inc. (NASDAQ: RMBS), the innovative technology solutions company that brings invention to market, today announced that its recent Convertible Bond, due 2018, generated a healthy demand from investors and was oversubscribed. The demand allowed Rambus to improve the financial terms as well as upsize the offering from the original $100 million to $120 million. In addition, the initial purchasers exercised their over-allotment option and

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Rambus Receives Provisional ENERGY STAR Certification for Revolutionary LED Bulb

SUNNYVALE, CALIFORNIA, UNITED STATES – 08/12/2013 – Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today announced that the company’s revolutionary 60 watt equivalent A19 LED bulb has gained provisional ENERGY STAR™ certification, validating the efficiency, lumen output, color temperature and light output distribution capabilities of the bulb. In order to meet the provisional ENERGY STAR certification, the bulb exceeded the 800 lumens requirement by delivering 850 lumens, maintained appropriate lumen output and color temperature,

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Rambus Announces Proposed $100 Million Convertible Senior Notes Offering

SUNNYVALE, CALIFORNIA, UNITED STATES – 08/12/2013 — Rambus Inc. (NASDAQ: RMBS) today announced its intention to offer, subject to market conditions and other factors, $100 million aggregate principal amount of its convertible senior notes due 2018 in a private placement to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended (the “Act”). Rambus also expects to grant the initial purchasers of the notes a 30-day option to purchase up to an additional $15 million

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Northwest Logic and Mixel Complete MIPI Solutions Continue to Win Over Customers

Nufront and YYG, Both Pacific Rim Companies, Go to Production with Multiple Mixel MIPI Solutions Mixel Continues to Gain Market Share with Global Customers Deploying its MIPI Solutions San Jose, CA – July 23rd, 2013 – Mixel®, the leader in mobile mixed-signal intellectual property (IP), announced today that both Nufront, a leader in Chinese mobile communication and computing, and Shenzhen Yunyinggu Technology Co. Ltd. (YYG), an innovative Chinese high-tech company with focus on next-generation display technology, have both licensed multiple

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Rambus Reports Second Quarter Financial Results

SUNNYVALE, CALIFORNIA, UNITED STATES – 07/18/2013 – Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today reported financial results for the second quarter ended June 30, 2013. GAAP Financial Results: Revenue for the second quarter of 2013 was $57.9 million, down 13% on a sequential basis from the first quarter of 2013 primarily due to recognition of one-time royalty revenue during the first quarter of 2013 from LSI Corporation. This was, however, partially offset by

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Rambus to Present on Thermal LED Design at InterPACK Conference

SUNNYVALE, CALIFORNIA, UNITED STATES – 07/15/2013 Who: Rambus Inc. (NASDAQ: RMBS) Where: InterPACK 2013 Hyatt Regency San Francisco Airport Hotel 1333 Bayshore Parkway Burlingame, CA When: July 15-18, 2013 Rambus Senior Principal Engineer, Thermal, Dr. Jim Petroski will chair the Thermal Management track, where he will present his paper on Advanced Natural Convection Cooling Designs for LED Bulb Systems. Dr. Petroski will also participate on a panel to discuss Rambus’ thermal LED design for effective cooling on an A-line lamp.

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Rambus to Present Digital Camera Sensor Technology at OSA Optical Sensors Congress

SUNNYVALE, CALIFORNIA, UNITED STATES – 07/15/2013 Who: Rambus Inc. (NASDAQ: RMBS) Where: OSA Optical Sensors Congress Rio Mar Beach Resort 6000 Rio Mar Boulevard Rio Grande, Puerto Rico 00745 When: July 16 at 12:00 p.m. AST Rambus scientists Dr. Patrick Gill and Dr. David Stork will highlight their research on digital sensors and novel odd-symmetry phase gratings, outlining how severely blurred sensed image can be inverted computationally to refocus and estimate target distances. Demonstration Session Details: Title: Digital camera with

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Aldec Verifies Compatibility of Northwest Logic’s PCI Express Cores with HES-7TM SoC/ASIC Prototyping Platform

Henderson, Nevada – July 11, 2013 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions, today announced that engineers incorporating high-speed PCI Express data transmission into their SoC and ASIC designs can accelerate their time-to-market utilizing Northwest Logic PCI Express IP Cores with Aldec’s HES-7™ prototyping platform. “Northwest Logic’s PCI Express IP cores enable designers to quickly create PCI Express-based SoC designs for a variety of markets including embedded applications, server development, communications, and more,”

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