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Home > Press Releases > Corporate > Media Alerts > Rambus to Present on Thermal LED Design at InterPACK Conference

Rambus to Present on Thermal LED Design at InterPACK Conference

SUNNYVALE, CALIFORNIA, UNITED STATES – 07/15/2013

Who: Rambus Inc. (NASDAQ: RMBS)
Where: InterPACK 2013
Hyatt Regency San Francisco Airport Hotel
1333 Bayshore Parkway
Burlingame, CA
When: July 15-18, 2013

Rambus Senior Principal Engineer, Thermal, Dr. Jim Petroski will chair the Thermal Management track, where he will present his paper on Advanced Natural Convection Cooling Designs for LED Bulb Systems. Dr. Petroski will also participate on a panel to discuss Rambus’ thermal LED design for effective cooling on an A-line lamp.

Demonstration Session Details:

Tuesday, July 16, 2013

Title: Thermal Management
2:15 p.m. – 3:45 p.m. PST
Sandpebble A/B
Session organized by Dr. Jim Petroski, Rambus, and co-organized by Amkor Technology

In this track, Dr. Jim Petroski will present his paper on Advanced Natural Convection Cooling Designs for LED Bulb Systems.

Wednesday, July 17, 2013

Title: How Can Thermal and Packaging Design Enable Low Cost 100W Equivalent LED A-line Lamps?
8:00 a.m. – 9:30 a.m. PST
Grand Peninsula B
Dr. Jim Petroski, Rambus, and lighting experts at CREE, Nuventix and GE Lighting Solutions

The task of delivering over 1600 lumens into a cost-effective A-line bulb shape introduces significant challenges in the areas of packaging and cooling because of its small size. The panel will discuss these issues and how novel thermal management and packaging technologies can have a significant impact.

For additional details, visit: www.rambus.com.

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