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Media Alert — Rambus To Showcase Its PCI Express* And Memory Interface Technologies At The Intel Developer Forum (IDF) 2005

Los Altos, California, United States
– 08/23/2005

Who: Rambus Inc. (Nasdaq:RMBS)

Where: Intel Developer Forum

Booth # 609

Moscone Convention Center West

San Francisco, CA. USA

When: August 23 – 25, 2005

At IDF, Rambus will showcase a number of its high-speed chip interface solutions, including its DDR2 PHY designs and its XDR™ memory interface solution with data rates ranging from 3.2-8.0 GHz.

In addition, Rambus and its partners will demonstrate and display its serial link interface products in key application areas:

  • Advanced Switching and Servers – Rambus will showcase its partners PLX Technologies, IDT and Stargen solutions using its PCI Express* PHY;
  • PC Graphics – Rambus PCI Express PHY customer boards from XGi and S3 will
    be on display;
  • PC Motherboards – Rambus will showcase the Rambus PCI Express PHY
    incorporated into ULi’s chipset solution;
  • Storage – Qlogic will be demonstrating its Fibre Channel adapter that uses
    Rambus’ PCI Express digital controller

Rambus’ integrated PCI Express solution, incorporating both digital controller and PHY technologies, will also be on display, demonstrating how an integrated solution can help reduce third-party vendor IP issues and speed time to market.

Rambus will also show its PCI Express PHYs passing the PCI Express Base 1.1 electrical compliance tests using the Tektronix TDS6154C Digital Storage Oscilloscope with RTEye™ PCI Express compliance test software.

* PCI Express is a trademark of PCI-SIG. Brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.

Teradici Selects Rambus XDR Memory Interface

Advanced XDR memory to enable disruptive enterprise and consumer computing models

Los Altos, California, United States – 08/22/2005
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced that fabless semiconductor company Teradici Corporation has signed a license agreement for Rambus’ XDR memory controller interface cell, dubbed XIO. As part of the agreement, Rambus will also provide the logic layer of the memory controller, the XMC. This agreement enables Teradici to develop an advanced, high performance solution for the next generation of enterprise and consumer computing.

“Teradici is developing a complex, high-speed chip design that requires the most advanced memory technology available today,” said Dan Cordingley, CEO at Teradici Corporation. “The combination of Teradici’s unique graphics algorithms and deep talent for integrated chip design, coupled with Rambus’ expertise in high-speed signaling, will enable us to provide a new approach for personal computing in the future. We look forward to a long and successful relationship with the Rambus engineering teams.”

The Rambus XIO cell is a high-performance, low-latency controller interface to XDR DRAM memory sub-systems, allowing up to 8 gigabytes-per-second of bandwidth in a 16-bit wide interface from a single memory device. It is a versatile CMOS macro cell that can be seamlessly integrated into a wide variety of target processes. The general purpose cell is independent of the logical memory controller design, enabling support for a wide variety of memory applications needing high bandwidth and low latency. The XIO provides a wide, on-chip, CMOS-level signaling interface to the memory controller logic and a narrow, high-speed Differential Rambus Signaling Level (DRSL) interface to the external XDR memory system.

“Working on advanced, innovative programs such as Teradici’s allows us to showcase our memory system architectures to new and interesting platforms,” said Laura Stark, vice president of Platform Solutions at Rambus. “Our engineering teams are focused on designing and developing the most advanced interface designs that help our customers meet the ever-increasing demands of the market.”

For additional information on all the Rambus interface products, please go to
www.rambus.com/products.

Rambus Announces Fully Integrated, Optimized PCI Express Solution

Industry-leading integrated controller and PHY deliver superior results in broad range of applications

[Update] Read our primer: Rambus launched PCI Express 5 »

Los Altos, California, United States – 08/08/2005
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced the availability of its fully integrated PCI Express* solution. This complete solution consists of silicon-proven digital controllers and PHY cells meeting the PCI Express 1.1 base specification. Supported by a PCI Express evaluation kit, the Rambus integrated solution is ideal for customers searching for end-to-end implementation and validation, which eliminates the interoperability risks and complexities associated with multi-vendor IP.

Rambus’s PCI Express solution includes vertically integrated testing features to help customers facilitate system bring-up and debug for improved production test coverage. The Rambus solution allows design optimizations to be made across the PHY and logic layers to result in lower power, area and latency for cost- and performance-sensitive applications.

“Our complete solution with both the digital controller and PHY ensures our customers can get their products to market faster by reducing integration and validation risks as well as providing value-added features that go beyond the current specifications,” said Laura Stark, vice president of the Platform Solutions Group at Rambus. “Designers are concerned about getting their PCI Express implementation to work the first time. With our solution they have a reliable, fully verified and interoperability-tested solution that greatly reduces the risk of integrating third-party IP.”

For a streamlined design-in experience, Rambus offers developers the PCI Express evaluation kit, a system level evaluation platform that supports:

  • Electrical characterization;
  • Compliance and interoperability validation;
  • Performance evaluation and optimization;
  • Application and software development;
  • Thorough validation of the target application

Rambus PCI Express digital controllers are highly configurable, and are delivered with a complete test environment, test cases and synthesis environment for maximum ease of integration. Rambus PCI Express PHY cells are available on multiple foundry and captive processes at process nodes ranging from 180nm to 65nm. Numerous Rambus customers are in production in high-volume applications such as graphics, chipsets, storage, and communications ICs.

Rambus has also demonstrated its Turbo PCI Express platform with serial links operating at 5.0Gbps and 6.25Gbps data rates to meet future PCI Express requirements. The Rambus PCI Express solution is represented with multiple entries on the PCI-SIG Integrators List, having passed compliance and interoperability testing by Rambus customers and partners. For more information on Rambus’s complete PCI Express offering, visit www.rambus.com/products/pciexpress.

Rambus Inc. to Present at B. Riley New York Investor Conference and Moors & Cabot Semiconductor Conference

Los Altos, California, United States – 08/04/2005
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced that Bob Eulau, Senior Vice President and Chief Financial Officer, will present a business overview at the Moors & Cabot Semiconductor conference on August 10, 2005 at 10:30 a.m. PT and B. Riley New York Investor Conference on August 11, 2005 at 8:10 a.m. PT.

This event will be available through a webcast and can be accessed at Rambus’s Investor Relations web site at http://investor.rambus.com/. The audio replay will be available on Rambus’s IR web site following the event.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus’s interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Bangalore, India, Chapel Hill, North Carolina, Taipei, Taiwan and Tokyo, Japan. Additional information is available at www.rambus.com.

QLogic Incorporates Rambus PCI Express Digital Controller In 4G Fibre Channel ASICs

ASICs used in market leading SANblade host bus adapters

Rambus Developer Forum, Tokyo, Japan – 07/08/2005
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced that QLogic Corporation (Nasdaq:QLGC), a storage area network (SAN) infrastructure company, has incorporated the Rambus PCI Express* digital controller core in their line of Fibre Channel storage processor ASICs. These ASICs are used in the popular QLogic SANblade line of Fibre Channel host bus adapters (HBAs), the year 2004 market share leader according to analyst firms Gartner, Dell’Oro and IDC.

“We chose the Rambus PCI Express end point core, because it was the most advanced core available on the market,” said Amit Vashi, senior director product marketing for QLogic Corporation. “Our engineers have given two thumbs up for the integration support that they received from the Rambus team.”

QLogic provides OEMs, resellers and system integrators with end-to-end SAN infrastructure solutions. The company produces the controller chips, host bus adapters, fabric switches and management software that are the backbone of storage networks for most Global 2000 corporations. QLogic serves customers with solutions based on all storage network technologies including SCSI, Internet SCSI (iSCSI), and Fibre Channel.

“The successful silicon implementation of our PCI Express digital controller is the result of Rambus’s rigorous design and verification processes and the extensive interoperability testing our team has performed with leading system platforms,” said Abhijit Sarid, group marketing manager for digital core products at Rambus. “This achievement underscores Rambus’s dedication to deliver products with the highest level of compatibility and reliability to ensure seamless integration into our customers’ designs.”

Rambus PCI Express digital controllers are highly configurable cores, available in end point, root complex, switch port, and hybrid (root complex and end point) configurations. The architecture is tailored to optimize link utilization, latency, power consumption and silicon footprint. The verilog cores are delivered with a complete test environment, test cases and synthesis environment for maximum ease of integration.

Rambus digital controllers are also available as part of a complete integrated PCI Express solution, which includes Rambus’s PCI Express PHY cells. The Rambus PCI Express PHY cells are available on multiple foundry and captive processes at process nodes ranging from 180nm to 65nm. Rambus’s PCI Express PHY cells are listed on the PCI-SIG Integrators List, having passed PCI-SIG compliance and interoperability testing by Rambus PHY cell customers and digital controller partners. The PCI-SIG is the special interest group that owns and manages PCI specifications as open industry standards. Rambus has also demonstrated its Turbo PCI Express platform with serial links operating at 5.0Gbps and 6.25Gbps data rates to meet future PCI Express requirements. For more information on Rambus’s broad PCI Express offering, visit www.rambus.com/products/pciexpress.

Rambus Reports Second Quarter Earnings

Earnings per share of 5 cents;

Los Altos, California, United States
– 07/14/2005
Rambus Inc. (Nasdaq: RMBS), one of the world’s
premier technology licensing companies specializing in high-speed
chip interfaces, today reported financial results for the second
quarter of 2005. Earnings per share for the quarter were 5 cents,
compared to 8 cents in the second quarter last year and 4 cents
in the previous quarter. Net income for the second quarter was
$5.4 million (13% of revenue), compared to $8.3 million in the
second quarter last year and $4.4 million in the previous
quarter. Revenues for the second quarter were $40.0 million, up
14% over the second quarter last year and up 1% from the previous
quarter.

We are pleased to report record revenues
for the second consecutive quarter. The second half of the year
is a challenge to forecast given the number of patent license
agreements and renewals we are currently negotiating. We remain
committed to signing agreements that generate long-term
value, said Harold Hughes, Chief Executive Officer
at Rambus. We have taken important and
necessary actions to protect our intellectual property while we
work on patent license renewals. We are very encouraged by the
growing interest we are seeing in our advanced high-speed
interface designs, particularly in our
XDRtm memory interface as well as the
momentum we are seeing with our PCI Express
solutions.

Second quarter results reflected $5.4 million in contract
revenues, up 1% over the second quarter last year and down 18%
from the previous quarter. This sequential decline in contract
revenue was a result of less revenue from contracts for XDR
memory interfaces and FlexIOtm as we
near the completion of initial contracts associated with the cell
processor and XDR DRAM. Second quarter results include $34.6
million in royalties, up 17% over the second quarter last year
and up 5% from the previous quarter. The increase in royalties
primarily reflects an increase in SDRAM and DDR royalties
relative to both periods.

Total costs and expenses were $34.4 million compared with
$24.4 million in the second quarter last year and $34.7 million
last quarter. $5.2 million of the increase over the second
quarter of last year was due to litigation expense. The remaining
increases were primarily related to increased costs in
engineering and administration.

The tax rate for the second quarter is 40.6% which is up from
37% in the first quarter due to a forecasted tax rate for 2005 of
39%. The two primary drivers of this increase in the tax rate are
our forecast for earnings before income tax and stock-based
compensation expense which is not deductible for income tax
purposes.

Cash, cash equivalents and marketable securities increased
from $460 million to $471 million since March 31, 2005. The
increase in cash was primarily attributable to cash generated by
operations.

The earnings announcement call will be broadcast live on our
website (www.rambus.com) at 2:00 p.m. PDT today. To experience
the audio of the Q2 Webcast, you need sound capabilities on your
personal computer and installation of RealPlayer or Windows Media
Player. These features are available at no cost.

The conference call replay number is 888-203-1112 and the ID
number is 5462558. For international callers, the number is
719-457-0820. The replay will be available on our website
beginning at 5:00 p.m. PDT today.

About Rambus Inc.

Rambus is one of the world’s premier
technology licensing companies specializing in the invention and
design of high-speed chip interfaces. Since its founding in 1990,
the company’s innovations, breakthrough
technologies and integration expertise have helped
industry-leading chip and system companies solve their most
challenging and complex I/O problems and bring their products to
market. Rambus’s interface solutions can be
found in numerous computing, consumer, and communications
products and applications. Rambus is headquartered in Los Altos,
Calif., with regional offices in Bangalore, India, Chapel Hill,
North Carolina, Taipei, Taiwan and Tokyo, Japan. Additional
information is available at www.rambus.com.

Condensed Consolidated Statements of Operations
(In thousands, except per share amounts)
(Unaudited)
Three Months Ended
June 30, 2005 March 31, 2005 June 30, 2004
Revenues:
Contract revenues $ 5,390 $ 6,600 $ 5,349
Royalties 34,595 33,011 29,616
Total revenues 39,985 39,611 34,965
Costs and expenses:
Cost of contract revenues 4,965 5,603 4,957
Research and development 9,934 8,591 7,929
Marketing, general & administrative 9,502 9,358 6,724
Litigation expense 9,980 11,140 4,747
Total costs and expenses 34,381 34,692 24,357
Operating income 5,604 4,919 10,608
Interest and other income, net 3,414 2,129 2,199
Income before income taxes 9,018 7,048 12,807
Provision for income taxes 3,658 2,608 4,483
Net income $ 5,360 $ 4,440 $ 8,324
Net income per share – basic $ 0.05 $ 0.04 $ 0.08
Net income per share – diluted $ 0.05 $ 0.04 $ 0.08
Shares used in per share
calculations:
Basic 99,596 100,280 102,500
Diluted 103,675 105,913 109,850
Six Months Ended
June 30, 2005 June 30, 2004
Revenues:
Contract revenues $ 11,990 $ 10,428
Royalties 67,606 57,078
Total revenues 79,596 67,506
Costs and expenses:
Cost of contract revenues 10,568 10,191
Research and development 18,525 15,356
Marketing, general & administrative 18,860 13,754
Litigation expense 21,120 8,925
Total costs and expenses 69,073 48,226
Operating income 10,523 19,280
Interest and other income, net 5,543 6,303
Income before income taxes 16,066 25,583
Provision for income taxes 6,266 8,954
Net income $ 9,800 $ 16,629
Net income per share – basic $ 0.10 $ 0.16
Net income per share – diluted $ 0.09 $ 0.15
Shares used in per share
calculations:
Basic 99,936 101,733
Diluted 104,693 110,560
Condensed Consolidated Balance Sheets
(In thousands)
(Unaudited)
June 30, 2005 March 31, 2005 December 31, 2004
Assets
Current assets:
Cash and cash equivalents $ 69,929 $ 208,021 $ 48,310
Marketable securities 101,470 96,802 89,483
Accounts receivable 1,667 3,596 1,435
Prepaid and deferred taxes 13,703 13,710 13,861
Prepaids and other current assets 5,481 4,009 4,094
Total current assets 192,250 326,138 157,183
Property and equipment, net 21,756 18,130 17,578
Marketable securities,
long-term		 299,325 155,360 98,567
Restricted investments 2,302 5,076 5,067
Deferred taxes, long-term 72,587 74,507 75,295
Purchased intangible assets,
net		 23,437 20,844 21,765
Other assets 10,744 8,418 1,269
Total assets $ 622,401 $ 608,473 $ 376,724
Total cash, cash equivalents, and marketable
securities		 $ 470,724 $ 460,183 $ 236,360
Liabilities And Stockholders’
Equity
Current liabilities:
Accounts payable and other current
liabilities		 $ 24,811 $ 21,671 $ 17,444
Deferred revenue 8,035 13,447 19,271
Total current liabilities 32,846 35,118 36,715
Notes payable 300,000 300,000 –
Deferred revenue, less current
portion		 6,630 5,314 4,552
Other long-term liabilities 1,992 – –
Total liabilities 341,468 340,432 41,267
Stockholders’ equity:
Common Stock 100 99 103
Additional paid-in capital 331,005 325,344 341,080
Deferred stock-based compensation (267) (1,548) –
Accumulated other comprehensive gain (loss) (1,028) (1,617) (878)
Accumulated deficit (48,877) (54,237) (4,848)
Total stockholders’ equity 280,933 268,041 335,457
Total liabilities and stockholders’
equity		 $ 622,401 $ 608,473 $ 376,724
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