BEIJING, CHINA – 04/13/2010
| Who: | Rambus Inc. (NASDAQ: RMBS) | |
| Where: | Intel Developer Forum China National Convention Center (CNCC) No. 7 Tianchen East Rd, Chaoyang District Beijing, China Booth: #G3 |
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| When: | April 13-14, 2010 | |
Join Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies, at the Intel Developer Forum (IDF) in Beijing. Rambus Fellow Craig Hampel will discuss memory architectures for multi-core computing during a talk on Tuesday, April 13 at 1:00pm in Room 307A at CNCC. In addition, Rambus will showcase live demos of its Mobile XDR™ memory architecture and new lighting technology, including MicroLens™ optical design technology.
Mobile XDR Memory Architecture
Rambus will demonstrate its Mobile XDR memory architecture, the world’s fastest and most power-efficient memory for mobile applications. Capable of achieving data rates of 3.2 to 4.3 Gigabits per second (Gbps) per pin at an unprecedented power efficiency of 2.2 milliwatts per Gigabit per second (mW/Gbps), Mobile XDR memory is ideal for the low-power and high-performance requirements of next-generation smartphones, netbooks, and mobile gaming and multimedia products.
Lighting Technology
Rambus’ MicroLens technology allows designers to achieve efficient uniform brightness in edge-lit LED backlights in a very economical manner. In large format displays such as HDTVs, Rambus’ technology can enable backlights that use fewer or less expensive LEDs than required for conventional edge-lit implementations.
Threaded Module Prototype
Rambus will also showcase its static prototype Threaded Module co-developed in partnership with Kingston Technology. This module is implemented using eight industry-standard DDR3 1333 DRAM devices, showing techniques that can increase data throughput by up to 50% and reduce power consumption by 20% when compared to conventional modules.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enhancing the end-user experience of computing, communications and consumer electronics applications. Rambus’ patented innovations and breakthrough technologies in the area of high-speed memory architectures and complementary technologies have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and renowned integration expertise solve some of the most complex chip and system-level interface challenges. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
