CEO to address market challenges and solutions during opening keynote
SUNNYVALE, CALIFORNIA, UNITED STATES – 01/25/2011
| Who: | Rambus Inc. (NASDAQ: RMBS) | |
| Where: | DesignCon 2011 Booth #207 Santa Clara Convention Center 5001 Great America Pkwy Santa Clara, California |
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| When: | January 31 – February 3, 2011 | |
Join Rambus, one of the world’s premier technology licensing companies, at DesignCon 2011. Harold Hughes, president and chief executive officer at Rambus, will examine current industry trends and discuss how new technologies and solutions will enrich the end-user experience of electronic systems during the event’s opening keynote. In addition, Rambus engineers will present six technical papers on memory and high-speed interface design.
“Innovation is the key to meeting the needs of our dynamic and fast-paced industry,” said Kevin Donnelly, senior vice president of IP Strategy at Rambus and IP Summit chair at DesignCon. “DesignCon provides a unique venue for engineers to discuss new solutions for the next-generation of electronics.”
Rambus Keynote:
Monday, January 31, 2011
12:30 – 1:00 p.m. PT
Title: Addressing a Challenging Market with Flexible Solution
Presenter: Harold Hughes, president and chief executive officer
Location: Theater
Rambus Presentations:
Title: A Way to Meet Bandwidth and Capacity Needs of Next-Generation Main Memory System
Tuesday, February 1, 2011
8:30 – 9:10 a.m. PT
Presenter: Ravi Kollipara, Senior Principal Engineer
This session presents four techniques that enable higher data rates of 1600-3200 Mbps for next-generation main memory systems with improved power efficiency and scalability.
Title: Modeling of Common Clocking Schemes for Statistical Link Simulation
Presenter: Dan Oh, Senior Principal Engineer
Tuesday, February 1, 2011
8:30 – 9:10 a.m. PT
This session will discuss methods for modeling the common jitter source between data and clock signals to improve modeling accuracy by capturing any jitter tracking between the signals.
Title: High Performance, Low Cost DDR3-1600Mbps+ Consumer Electronics Memory Interface Co-design
Tuesday, February 1, 2011
2:00 – 2:40 p.m. PT
Presenter: Yi Lu, Senior Member of Technical Staff
Rambus engineers will discuss the techniques and benefits of a concurrent design approach for a low-cost, high-performance DDR3 DTV/STB memory interface.
Title: A Study of Optimal Data Rate of High-Speed Links
Tuesday, February 1, 2011
2:00 – 2:40 p.m. PT
Presenter: Wendem Beyene, Senior Principal Engineer
This session will present an approach for determining the data rate for optimal power efficiency for high-speed links given their differing topologies and channel characteristics.
Title: SI/PI for 1600MHz DDR3 PHY in Wirebond Package
This paper is a Finalist for a DesignCon Paper Award
Wednesday, February 2, 2011
2:00 – 2:40 p.m. PT
Presenter: June Feng, Senior Member of Technical staff
This session will present the signal and power integrity analysis and design techniques used to optimize a high-speed DDR3 interface for implementation in low-cost, high-volume manufacturing.
Title: On-chip Characterization of Signal and Power Integrity in 3-D Packaged Systems
Thursday, February 3, 2011
9:50 – 10:30 a.m. PT
Presenter: Hai Lan, Senior Member of Technical Staff
The authors will discuss on-chip measurement techniques which enable signal and power integrity characterization of complex 3-D packaged systems.
Rambus Demos
- Mobile XDR™ Memory – Fastest and most power-efficient memory for mobile applications.
- DDR3 Memory Interface – High-performance, low-cost PHY tailored for consumer electronics.
- Module Threading – Improves data throughput by up to 50% while reducing power by 20%.
- XDR™ Product Showcase – Featuring XDR-based products, including Sony PlayStation®3, Dell On-the-go® projector, Toshiba Qosmio® laptop and AMD FirePro™ remote graphics card.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Rambus’ patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Sunnyvale, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.
