FORT WORTH, TEXAS, UNITED STATES – 10/18/2011
|Who:||Rambus Inc. (NASDAQ: RMBS)|
Fort Worth Convention Center
Fort Worth, TX
|When:||October 16-20, 2011|
Join Rambus, one of the world’s premier technology licensing companies, at SMTA International to learn more about package-on-package (PoP) solutions for next-generation electronics.
Package-on-Package (PoP) Assembly Challenges and Solutions for
Low-Volume Engineering Prototype and Test Applications
Deborah Dressler, Ming Li, Donald Mullen, Rambus Inc.
Tuesday, October 18, 2011, 2:00-3:30 p.m. Central Time
Rambus’ presentation will focus on advances in package-on-package assembly and design, and the implications of wider application of PoP in smartphones and media tablets. Attendees will hear about next-generation PoP technologies.
SMTA International offers a platform for the electronics industry’s leading assembly experts and suppliers to address challenges through the exchange of technical knowledge on advances in manufacturing.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enriching the end-user experience of electronic systems. Rambus’ patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.