Advanced architecture supports superior image quality in high-performance, cost-competitive application
LOS ALTOS, CALIFORNIA, UNITED STATES – 06/19/2007 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, today announced that its XDR™ memory architecture has been adopted in Texas Instruments Incorporated (TI) (NYSE: TXN) DLP® technology. Projectors powered by the DLP chip utilizing the XDR memory architecture provide unmatched image quality and stunning color, and are ideal for displaying movies, sports, games or digital photos.
“The XDR memory architecture and its innovative technologies are key enablers of the razor-sharp images and excellent reproduction of fast-motion video made possible by the advanced DLP chip architecture,” said Lars Yoder, vice president and manager, Front Projection Business Unit, DLP Products, Texas Instruments Incorporated. “The Rambus engineering teams supported us with complete services from design through production helping us make a new generation of amazing DLP projectors a reality.”
The DLP chip with its millions of microscopic mirrors and the sophisticated electronics that surround it, including the Rambus XDR memory architecture, deliver a stunning viewing experience. The XDR memory architecture operating at 4.0GHz with a single, 2-byte wide XDR DRAM provides an unmatched 8.0 GB/s of peak memory bandwidth. The Rambus XDR DRAM, XDR Memory Controller (XMC), XDR IO Cell (XIO), and XDR Clock Generator (XCG) work together seamlessly to provide the unprecedented levels of memory performance required to generate the precise, lifelike images rich with color, contrast and brightness delivered by DLP technology.
“TI’s DLP technology sets the standard with compelling images demanded by both consumers and businesses,” said Sharon Holt, senior vice president of worldwide sales, licensing and marketing at Rambus Inc. “Rambus and Texas Instruments have a long history of collaboration on leading-edge DLP solutions, and we are very proud to continue our focus on designing and delivering advanced technology that enriches the end-user experience.”
The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); Octal Data Rate (ODR) technology that transfers eight bits of data on each clock cycle; FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for point-to-point signaling on the data bus.
Proven in high-volume and cost-competitive applications, Rambus solutions are backed by comprehensive engineering support services that range from chip design to system integration, and can scale for future cost reduction. For more information on the XDR memory architecture, as well as the next generation of XDR, the 8GHz XDR2 DRAM with micro-threading, please visit www.rambus.com/xdr. XDR DRAM licensees include Elpida Memory Inc., Qimonda AG, and Samsung Electronics Co. Ltd.