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HBM3E Controller
https://www.rambus.com/interface-ip/hbm/hbm3-controller/HBM3E / HBM3 Controller IP Contact Us The Rambus HBM3E / HBM3 controller cores are designed for use in applications requiring high memory bandwidth and low latency including AI/ML, HPC, advanced data center workloads and graphics. Secure Site Login ContactProduct Brief The HBM3E Memory Subsystem HBM3E is a high-performance memory that features reduced power consumption […]
Rambus Joins Arm Total Design
https://www.rambus.com/blogs/rambus-joins-arm-total-design/Generative AI and other advanced workloads bring even greater urgency to accelerate the power of computing. Training models are scaling by an incredible 10X per year, with the largest now , and are showing no sign of slowing. At the same time, AI inference is pushing out from the data center to millions and ultimately […]
Memory Key to Enabling AI: A Recap of AI Hardware Summit
https://www.rambus.com/blogs/focus-on-memory-at-ai-hardware-summit/By Steven Woo, Rambus Fellow Last week, I had the pleasure of hosting a panel at the AI Hardware & Edge AI Summit on the topic of “Memory Challenges for Next-Generation AI/ML Computing.” I was joined by David Kanter of MLCommons, Brett Dodds of Microsoft, and Nuwan Jayasena of AMD, three accomplished experts that brought […]
Rambus Moderates Panel on “Memory Challenges for Next-Generation AI/ML Computing” at AI Hardware Summit
https://www.rambus.com/blogs/rambus-moderates-panel-on-memory-challenges-for-next-generation-ai-ml-computing-at-ai-hardware-summit/Dr. Steven Woo, distinguished inventor and fellow at Rambus will be moderating an upcoming panel at the AI Hardware Summit on Tuesday, September 12th, 2023 starting at 3:00pm PT at the Santa Clara Marriott. Memory continues to be a critical bottleneck for AI/ML systems, and keeping the processing pipeline in balance requires continued advances in […]
PCI Express 5 vs. 4: What’s New? [Everything You Need to Know]
https://www.rambus.com/blogs/pci-express-5-vs-4/Introduction What’s new about PCI Express 5 (PCIe 5)? The latest PCI Express standard, PCIe 5, represents a doubling of speed over the PCIe 4.0 specifications. We’re talking about 32 Gigatransfers per second (GT/s) vs. 16GT/s, with an aggregate x16 link duplex bandwidth of almost 128 Gigabytes per second (GB/s). This speed boost is needed […]
Rambus Completes Sale of PHY IP Assets to Cadence
https://www.rambus.com/rambus-completes-sale-of-phy-ip-assets-to-cadence/SAN JOSE, Calif. – September 7, 2023 – Rambus Inc. (NASDAQ: RMBS) a premier chip and silicon IP provider making data faster and safer, today announced the completion of the previously announced sale of its PHY IP business to Cadence Design Systems, Inc. With this transaction, Rambus strengthens its focus on high-growth chips and digital IP, […]
Cadence to Acquire Rambus PHY IP Assets
https://www.rambus.com/cadence/Rambus Completes Sale of PHY IP Assets to Cadence On September 7, 2023, Rambus Inc. (Nasdaq: RMBS), announced the completion of the previously announced sale of its PHY IP business to Cadence Design Systems, Inc. This site provides additional information on the transaction and related documents. Both companies are committed to the ongoing success of our […]
Memory Systems for AI in the Data Center
https://go.rambus.com/memory-systems-for-ai-in-the-data-center#new_tabDevelopments in generative AI and Large Language Models are moving at a lightning pace. Incredible amounts of data must be processed and moved to train models which at their largest now exceed one trillion parameters. Join Rambus Fellow and Distinguished Inventor, Dr. Steven Woo, as he discusses the memory and interface technologies critical to powering next-generation computing […]
CXL Technology: Revolutionizing the Data Center
https://go.rambus.com/cxl-technology-revolutionizing-the-data-center#new_tabThe need for more memory bandwidth and capacity continues to rise, with applications like generative AI pushing current data center infrastructure to the limit. The leading companies at every level of the data center value chain are coalescing around CXL technology as a path to revolutionize the data center. Join Mark Orthodoxou to hear how […]
Innovations in CXL 3.0: Novel Device Types, Capabilities, and Interconnects
https://go.rambus.com/innovations-in-cxl-3-novel-device-types-capabilities-and-interconnects#new_tabCXL 3.0 introduces several compelling new features to address the rapidly evolving demands of future data centers. A new device type, CXL Multi-Headed Devices, has been introduced to support simultaneous connection to multiple hosts. CXL Dynamic Capacity Device (DCD) capability simplifies migration of memory resources between hosts. New CXL Fabrics offer substantial scale and flexibility […]
