At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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More CXL Webinar Q&A
https://www.rambus.com/blogs/more-cxl-webinar-q-and-a/In our recent webinar How CXL Technology will Revolutionize the Data Center (available on-demand), we received far more questions than we had time to address during the scheduled Q&A. What follows are answers to many of those questions providing greater context on the capabilities of Compute Express Link™ (CXL™) technology. Click on a link below […]
Automotive Security: Meeting the Growing Challenges
https://go.rambus.com/automotive-security-meeting-the-growing-challenges#new_tabVehicle systems and the semiconductors used within them represent some of today’s most complex electronics. In the drive to autonomous vehicles, increasingly sophisticated electronic systems are being developed for powertrain and vehicle dynamics, advanced driver assistance systems (ADAS), vehicle-to-everything (V2E) connectivity, infotainment, and in-vehicle experience. In addition to achieving higher levels of performance, these systems […]
VESA Display Stream Compression (DSC): The Complete Guide
https://www.rambus.com/blogs/vesa-display-stream-compression-dsc-the-complete-guide/Learn everything you need to know about VESA Display Stream Compression (DSC), simply explained in our blog. Start reading! Display technology has advanced in leaps and bounds over the past decade. Electronics manufacturers have been using increasingly sophisticated display features as a way of differentiating their products in the highly competitive consumer electronics market. Each […]
Going Beyond the Requirements of a Root of Trust for Measurement with the Silicon-Proven RT-660 Root of Trust
https://go.rambus.com/going-beyond-the-requirements-of-a-root-of-trust-for-measurement#new_tabThe continuously evolving technology landscape and security requirements for systems present many challenges for device and silicon manufacturers. Nowhere is this truer than in data centers. Rambus has long recognized the need for security designs in data centers, and the Caliptra initiative discussed in this whitepaper is a welcome step towards a widespread adoption of […]
Accelerating AI/ML applications in the data center with HBM3
https://www.rambus.com/blogs/accelerating-ai-ml-applications-in-the-data-center-with-hbm3/Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the data center with HBM3. Introduced by JEDEC in early 2022, the latest iteration of the high bandwidth memory standard increases the per-pin data rate to 6.4 Gigabits per second (Gb/s), […]
Rambus Reports Third Quarter 2022 Financial Results
https://www.rambus.com/third-quarter-2022-financial-results/Exceeded guidance for Q3 revenue and earnings Delivered record quarterly product revenue driven by memory interface chips Generated $80 million in cash from operations Initiated $100 million accelerated share repurchase program SAN JOSE, Calif. – October 31, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported […]
Rambus and Samsung Electronics Extend Comprehensive Agreement
https://www.rambus.com/rambus-and-samsung-electronics-extend-comprehensive-agreement/Ten-year agreement enables deep collaboration on products and broad access to Rambus innovations SAN JOSE, Calif. – Oct. 31, 2022 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with Samsung Electronics, a world leader in advanced semiconductor […]
CXL 3.0: Novel Device Types, Capabilities, and Interconnects
https://www.rambus.com/cxl3-novel-device-types-capabilities-and-interconnects/This video introduces new concepts that were developed as part of the latest CXL 3.0 specification released in August 2022. Danny Moore covers Multi-Headed Device (MHD) and Dynamic Capacity Device (DCD) capabilities, and how Fabrics, Fabric Switches and Port-based routing mechanisms expand the CXL interconnect beyond the rack for the data center of the future.
Boosting Data Center Performance to the Next Level with PCIe 6.0 & CXL 3.0
https://www.rambus.com/blogs/boosting-data-center-performance-to-the-next-level-with-pcie-6-0-cxl-3-0/2022 has seen major updates to two standards critical to the future evolution of the data center: PCI Express® (PCIe®) and Compute Express Link™ (CXL™). The two are interwoven, and in this blog, we’ll look at their relationship and the impact of latest developments. Like many standards in the computing world, PCIe has proliferated far […]
Rambus Delivers PCIe 6.0 Interface Subsystem for High-Performance Data Center and AI SoCs
https://www.rambus.com/rambus-delivers-pcie6-interface-subsystem-for-high-performance-data-center-and-ai-socs/Highlights: Delivers data rate of up to 64 GT/s for high-performance workloads Supports the full feature set of PCIe 6.0 with PHY support for CXL 3.0 Offers complete IP solution optimized for latency, power, and area Provides cutting-edge security to protect valuable data assets SAN JOSE, Calif. – Oct. 24, 2022 – Rambus Inc. (NASDAQ: RMBS), […]
