Home > Search
Found 3637 Results
Winbond Electronics has licensed differential power analysis (DPA) countermeasures from Rambus’ Cryptography Research division. By implementing DPA countermeasures in flash memory components, Winbond will ensure the data integrity of products that run applications requiring a high level of security – including mobile payments, premium content, automotive and the Internet of Things (IoT). “As we set […]
Our technology turns incredible possibility into everyday reality. The world is restless. It doesn’t stand still and it can’t stop wanting more. It screams ‘faster’. Needs ‘easier’. Demands ‘smarter and safer’. Our purpose is clear; we embrace that demand, we harness that restless spirit. We invent and create great things because we know that better […]
DPA Countermeasures will protect data integrity in flash memory components against security attacks SUNNYVALE, Calif. – September 21, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced that Winbond Electronics Corporation, a leading maker of top quality memory solutions, has licensed Rambus Cryptography Research differential power analysis, or DPA, countermeasures to protect industry-leading, flash memory components. By […]
Did you know that the terms “latency” and “bandwidth” are frequently misused? According to Loren Shalinsky, a Strategic Development Director at Rambus, latency refers to how long the CPU needs to wait before the first data is available. Meanwhile, bandwidth describes how fast additional data can be “streamed” after the first data point has arrived.
HBM Controller Core has been Hardware Validated Northwest Logic’s HBM Controller Core has now been hardware validated using a platform from eSilicon which consists of a Xilinx Virtex-7, SK Hynix Gen1 HBM Device and an organic interposer. This platform performs error-free, high-performance transfers between the controller and the HBM. The HBM Controller Core supports all […]
Did you know that the terms “latency” and “bandwidth” are frequently misused? According to Loren Shalinsky, a Strategic Development Director at Rambus, latency refers to how long the CPU needs to wait before the first data is available. Meanwhile, bandwidth describes how fast additional data can be “streamed” after the first data point has arrived. […]
The International Conference for High Performance Computing, Networking, Storage and Analysis will return to Austin for its 27th annual conference.
Made for high speed, reliability and power efficiency, our DDR3 and DDR4 chipsets, recently acquired from Inphi, for RDIMM and LRDIMM server modules deliver top-of-the-line performance and capacity for the next wave of enterprise and data center servers. Learn more about Rambus’ server DIMM Chipsets here.
Download “Challenges and Solutions for Future Main Memory” DDR3 SDRAM is used in many computing systems today and offers data rates of up to 1600Mbps. To achieve performance levels beyond DDR3, future main memory subsystems must attain faster data rates while maintaining low power, high access efficiency and competitive cost. This whitepaper will outline some […]
Emerging Solutions Beyond DDR4: Next-Generation Main Memory Focused on advancing single-ended signaling technologies to meet the memory system requirements of next-generation computing applications while maintaining compatibility with current industry standard DDR4 solutions, this next-generation R+ main memory architecture advances single-ended signaling up to 6.4 gigabits per second (Gbps) in a multi-rank, multi-DIMM system. Contact Improved […]
