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Brings over 20 years of finance and semiconductor experience SAN JOSE, Calif. – August 1, 2022 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has appointed Mr. Desmond Lynch to the position of senior vice president and chief financial officer. Mr. Lynch will be responsible for […]
Delivered Q2 revenue and earnings at the high end of guidance Achieved record quarterly product revenue driven by memory interface chips Expanded DDR5 portfolio with introduction of companion chips for server and client memory modules Generated $56.5 million in cash from operations SAN JOSE, Calif. – August 1, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of […]
1. Introduction As silicon manufacturing process nodes keep shrinking and transistors get smaller, System-on-Chip (SoC) are increasingly subject to failures due to changing external conditions such as temperature, EMI, power surges, Hot Plug events, etc. The transition to PCIe 5.0 and 6.0 with increasing PCIe signaling speeds (32GT/s and 64GT/s) also increases the risk of errors due to constricted […]
Download this product to learn more about the Rambus SPD Hub with Temperature Sensor (PD5118-G1B).
The Rambus Temperature Sensor (TS) TS5110-G1B enables DDR5 Registered DIMMs (RDIMMs), Load Reduced DIMMs (LRDIMMs) and Non-Volatile memory DIMMs (NVDIMMs). Two TS are used per DIMM which along with the SPD Hub’s internal TS provide three points of thermal telemetry.
The first wave of DDR5-based servers sport RDIMMs running at 4800 megatransfers per second (MT/s). This is a 50% increase in data rate over top-end 3200 MT/s DDR4 RDIMMs in previous generation high-performance servers. DDR5 memory incorporates a number of innovations, including Decision Feedback Equalization (DFE) and a new DIMM architecture, which enable that speed […]
Highlights: Introduces SPD Hub and Temperature Sensor as part of server and client DDR5 memory module chipsets Complements industry-leading DDR5 RCD delivering state-of-the-art bandwidth and capacity Enables enhanced system management and thermal control for improved TCO SAN JOSE, Calif. – July 18, 2022 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and […]
Rambus Fellow, Steven Woo, returns to the Rambus Design Summit stage tomorrow, and we are so excited for his keynote: Advancing Computing in the Accelerator Age! In our last interview before the show, we met with Steven to chat about his background, CXL, and some of the biggest challenges for computing in the years ahead. Read […]
We’re so excited that Ann Keffer, Product Marketing Manager at Siemens EDA, will be joining us on the (virtual) stage at Rambus Design Summit! Ahead of the show, we talked to Ann about autonomous driving, what she loves to do in her free time, and growth drivers for the Siemens EDA business. Read on for […]
From concept to production, designing a PCIe 5.0 device requires a long development cycle owed largely to heavy efforts on verification and validation. Today, a large collection of tools enable simulation to find bugs during the verification process or to generate PCIe transactions to validate the device. However, these tools are not enough to provide […]
