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Securing the Silicon Supply Chain
https://medium.com/supplyframe-hardware/securing-the-silicon-supply-chain-2499474d6387#new_tabI don’t know about you, but when I hear the name Rambus, I think of the company that was founded in 1990. I remember them leaping into the limelight with a fanfare of trumpets. Well, if the truth be told, it was with their 600 MHz interface technology, which addressed the memory bottleneck issues being […]
5G and AI Raise Security Risks for IoT Devices
https://go.rambus.com/5g-and-ai-raise-security-risks-for-iot-devices-webinar#new_tab5G represents a revolution in mobile technology with performance that will rival that of wireline networks. 5G’s Ultra-reliable Low Latency Communication (uRLLC) links will enable a profusion of artificial intelligence (AI)-powered IoT devices from delivery drones to smart cities. The rapid rise in the number of smart IoT devices, coupled with expanded connectivity, will greatly […]
Dangers of Counterfeit Semi Chips
https://www.designnews.com/cyber-security/dangers-counterfeit-semi-chips/122302744362434#new_tabIn 2019, the worldwide fake semi market was estimated at $75 billion according to Industry Week. This counterfeit chip market particularly prevalent in the government and defense industries. According to a US government report, more than 1 million counterfeit electronic components were used in 1,800 instances affecting military aircraft and missiles.
Memory Systems for AI: Part 4
https://www.rambus.com/blogs/memory-systems-for-ai-part-4/In part three of this series, we discussed how a Roofline model can help system designers better understand if the performance of applications running on specific processors is limited more by compute resources, or by memory bandwidth. Rooflines are particularly useful when analyzing machine learning applications like neural networks running on artificial intelligence (AI) processors. […]
Rambus’ HBM2E Memory Controller & PHY Offer Chipmakers Cost-Effective Designs
https://www.tomshardware.com/news/rambus-hbm2e-memory-controller-phy-designs#new_tabThe latest generation of high-bandwidth memory, HBM2E, is around the corner. Now that Samsung has started mass production of its HBM2E memory stacks, Rambus has unveiled its controller and PHY (physical interface) designs.
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
https://www.anandtech.com/show/15599/rambus-develops-hbm2e-controller-phy-32-gbps-1024bit-bus#new_tabThe latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they are also going to need an appropriate controller as well as physical interface. For many companies developing of such IP in-house does not make financial sense, so […]
Memory Systems for AI: Part 3
https://www.rambus.com/blogs/memory-systems-for-ai-part-3/In part two of this series, we took a closer look at how the upcoming deployment of 5G technology will enable processing at the edge, and how the industry is further refining the edge into the near edge and the far edge. The near edge is closer to the cloud, while the far edge is […]
Complete Memory Interface Solution for HBM2E Launched
https://www.rambus.com/blogs/complete-memory-interface-solution-for-hbm2e-launched/Rambus has announced a comprehensive interface solution for HBM2E memory consisting of co-verified PHY and memory controller. Operating at a top speed of 3.2 Gbps over a 1024-bit wide interface, the interface can deliver 410 GB/s of bandwidth with a single HBM2E DRAM stack. Read first our primer on: HBM2E Implementation & Selection – The […]
2.5D/3D Packaging Solutions for AI and HPC
https://go.rambus.com/packaging-solutions-for-ai-and-hpc#new_tabFor AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
Memory For Advanced Designs
https://www.forbes.com/sites/tomcoughlin/2020/02/26/memory-for-advanced-designs/#7131ec20188f#new_tabThe 2020 Designcon conference included many talks and exhibits with a storage and memory focus. Both Rambus and Teledyne LeCroy had tutorials on design and connectivity for leading edge electronic components and systems as well as testing memory systems. This piece will look at some material from the tutorials and exhibits that can inform us about disaggregated […]
