Download the product brief to see the specifications and features of the Rambus DDR5 PMIC5030.
Scaling AI Infrastructure with PCIe 7 and CXL 3
Interconnect technologies are key to scaling AI workloads across data center infrastructure. Learn how PCIe 7 and CXL 3 enable high-speed, low-latency connectivity for memory expansion and composable architectures in AI systems.
Memory IP for AI Accelerators: HBM4, LPDDR5, and GDDR7
AI accelerators require high-performance memory IP to meet bandwidth, capacity and latency requirements. This session dives into Rambus IP solutions for HBM4, LPDDR5, and GDDR7, highlighting their role in powering next-gen AI silicon.
How AI is Shaping the Memory Market
Join Rambus experts for a dynamic roundtable discussion on the latest trends in the memory market. Topics include AI-driven demand, enabling technologies, and the future of memory innovation across computing segments.
Memory Interface Chip Solutions for PC Clients and AI
AI is increasingly moving to the edge, and PC clients are evolving to support intelligent applications. This session showcases Rambus memory chip solutions optimized for client platforms, enabling responsive AI experiences with performant memory architectures.
Memory Interface Chip Solutions for Servers and AI in the Data Center
Explore Rambus memory chip solutions designed for server platforms and AI workloads in the data center. This session covers performance, power efficiency, and scalability features that meet the demands of next-generation AI training and inference environments.
