In response to an exponential growth in data, the industry is on the threshold of a groundbreaking architectural shift that will fundamentally change the performance, efficiency and cost of data centers around the globe. Server architecture, which has remained largely unchanged for decades, is taking a revolutionary step forward to address the growing demand for data and the voracious performance requirements of advanced workloads.
Rambus Advances New Era of Data Center Architecture with CXL™ Memory Interconnect Initiative
- Launches research and development effort to drive architectural shift in data centers with solutions for memory expansion and pooling that enable disaggregated and composable server architectures
- Combines unique expertise in high-speed interfaces, embedded security and server memory buffers to develop breakthrough solutions for next-generation data centers
- Leverages critical building blocks to be provided by PLDA and AnalogX acquisitions, accelerating CXL roadmap and market leadership
SAN JOSE, Calif. – June 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the CXL Memory Interconnect Initiative to define and develop semiconductor solutions for advanced data center architectures that maximize performance, improve efficiency and reduce system cost. To support the continuing growth and specialization in server workloads, data center is moving to disaggregated architectures composed from shared and scalable pools of computing and memory resources. Compute Express Link™ (CXL) is a critical enabler of these next-generation disaggregated server architectures. As part of this initiative, Rambus is focusing its initial research and development on semiconductor solutions to support key memory expansion and pooling use cases. The acquisitions of PLDA and AnalogX provide key products and expertise that complement the company’s leadership in server memory interface chips and further accelerate the roadmap for innovative CXL interconnect solutions for next-generation data centers.
“Modern server architectures are taking a revolutionary step forward to support the growing demands of advanced workloads like AI/ML,” said Luc Seraphin, president and CEO of Rambus. “This initiative is highly complementary to our existing server DIMM chipset business and brings together our unique combination of semiconductor and system expertise to develop breakthrough interconnect solutions that improve performance, security, efficiency and TCO for future data centers.”
CXL is an open industry standard interconnect delivering high-bandwidth, low-latency connectivity between dedicated compute, memory, I/O and storage elements within the data center to allow the provision of the optimal mix of each for a given workload. CXL memory expansion and pooling chips are key components for both traditional and disaggregated architectures. Rambus is uniquely positioned to deliver these solutions as a leading provider of the diverse set of required building blocks including:
- CXL and PCIe® PHYs and controllers to interface with host processors and other devices
- DDR memory PHYs and controllers to interface with memory devices
- Advanced cryptographic cores and secure protocol engines to enable secure firmware downloads and protect the links against data tampering and physical attacks with Integrity and Data Encryption (IDE) security
In addition, Rambus has extensive experience delivering memory interface chips at high volume to the server ecosystem and critical system-level expertise to speed time to market. Rambus is engaging with the full ecosystem including cloud, system and memory companies, to accelerate the development and enablement of CXL memory interconnect solutions.
For more information, visit rambus.com/cxlmemoryinterconnects
Rambus to Acquire PLDA, Extending Leadership with Cutting-Edge CXL™ and PCI Express® Digital IP
- Expands digital controller IP portfolio with complementary CXL 2.0, PCIe® 5.0 and PCIe 6.0 controller and switch IP
- Enables integrated interface subsystem solutions for data center, artificial intelligence and machine learning (AI/ML), and High Performance Computing (HPC)
- Provides critical building blocks for Rambus CXL Memory Interconnect Initiative to advance high-bandwidth connectivity
SAN JOSE, Calif. – June 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has signed an agreement to acquire PLDA, an industry leader in Compute Express Link (CXL) and PCI Express (PCIe) digital solutions. The data center industry is on the verge of a groundbreaking shift to disaggregated architectures that promise to dramatically improve performance, efficiency and cost of ownership. CXL and PCIe will be critical enablers for these next-generation systems, delivering the high-speed interconnects between processors, accelerators, memory and network devices needed to tackle demanding workloads in AI/ML and HPC applications. With the addition of the world-class digital IP and engineering expertise from PLDA, Rambus will further its leadership in these mission critical interconnect chips and IP solutions for the future data center.
“We are in the midst of a generational shift in data center, and PCI Express and CXL are the backbone of future architectures,” said Luc Seraphin, president and CEO of Rambus. “Leveraging our combined offerings and expertise, we will be able to expand market opportunity and accelerate our roadmap of new memory interconnect products, ushering in a new era of global data center connectivity.”
PLDA CXL 2.0, PCIe 5.0 and PCIe 6.0 controller and switch IP expand the Rambus portfolio and accelerate the time to market for complete CXL interface subsystems. In addition, this acquisition enhances the Rambus roadmap for PCIe 6.0 and CXL 3.0 solutions, and provides critical building blocks for the CXL Memory Interconnect Initiative.
“PLDA’s industry-leading digital IP ideally complements the Rambus product offering and this acquisition will augment our combined market opportunity,” said Arnaud Schleich, co-founder and CEO of PLDA. “The team and I are extremely excited to join Rambus, and look forward to being instrumental in scaling the business.”
The transaction is expected to close in the third calendar quarter of 2021. Although this transaction will not materially impact 2021 results due to the expected timing of close and acquisition accounting, Rambus expects this acquisition to be accretive in 2022.
Rambus to Acquire AnalogX, Accelerating Next-Generation Data Center Interface Solutions
- Extends leadership in PCIe® 5.0 and 32G Multi-protocol SerDes with ultra-low power interface IP
- Accelerates time to market and enhances the Rambus roadmap for PAM4-based PCIe 6.0 and CXL™ 3.0 solutions for data center, artificial intelligence and machine learning (AI/ML), 5G and High Performance Computing (HPC)
- Provides critical building blocks for Rambus CXL Memory Interconnect Initiative to advance high-bandwidth connectivity
SAN JOSE, Calif. – June 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has signed an agreement to acquire AnalogX, the leading provider of low power multi-standard connectivity SerDes IP solutions. This acquisition augments the Rambus family of PCIe 5.0 and 32G Multi-protocol PHYs with SerDes technology specifically built for ultra-low power and very low latency, expanding the addressable applications and available process nodes. AnalogX’s expertise in DSP-based design and PAM4 signaling accelerates the Rambus roadmap for PCIe 6.0 and CXL 3.0 solutions and will provide critical building blocks for the CXL Memory Interconnect Initiative.
“As data centers move to a disaggregated model, high-speed connectivity will be instrumental to unleashing the performance of data-intensive computing platforms,” said Luc Seraphin, president and CEO of Rambus. “The industry-leading PHYs and DSP design expertise from AnalogX will feed our roadmap for data center interconnect chips and expand our reach to new applications across data center, AI/ML and 5G.”
“AnalogX’s product, technology and team are an ideal fit with Rambus,“ said Robert Wang, president and CEO of AnalogX. “We’re thrilled to join a company with such a rich history on innovation and look forward to continuing our technical leadership and providing premier integrated solutions for next-generation products.”
The transaction is expected to close in the third calendar quarter of 2021. Although this transaction will not materially impact 2021 results due to the expected timing of close and acquisition accounting, Rambus expects this acquisition to be accretive in 2022.
Rambus Initiates Accelerated Share Repurchase Program
SAN JOSE, Calif., June 16, 2021 – Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that it initiated an accelerated share repurchase program with Deutsche Bank AG, London Branch as counterparty, through its agent Deutsche Bank Securities Inc. (Deutsche Bank) to repurchase an aggregate of approximately $100 million of its common stock, with an initial delivery of approximately 4.0 million shares.
“This program demonstrates our confidence in the future growth of the company,” said Luc Seraphin, president and chief executive officer at Rambus.“ Our strong balance sheet and strategic approach to capital allocation allow us to invest organically and inorganically while continuing to deliver long-term value to our stockholders.”
Under the accelerated share repurchase program, Rambus will pre-pay to Deutsche Bank the $100 million purchase price for its common stock and, in turn, Rambus will receive an initial delivery of approximately 4.0 million shares of its common stock from Deutsche Bank within the first week of the program. The number of shares to be purchased ultimately by Rambus will be determined based on the volume-weighted average price of Rambus common stock during the terms of the transaction, minus an agreed upon discount between the parties. The program is expected to be completed within six months. The shares of common stock will be delivered by Deutsche Bank to Rambus on the third business day following the calculation period described above.
The accelerated share repurchase program is part of the broader 20 million share repurchase program previously authorized by the Rambus Board of Directors in October 2020.
Separately, Rambus affirmed its previously issued guidance for the fiscal quarter ending June 30, 2021, as set forth on the Current Report on Form 8-K furnished with the Securities and Exchange Commission on May 3, 2021.
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