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Who is Rambus?
Rambus CTO On Tokenization, Part Deux
Tokens are nothing new. PCI tokens, encrypted card credentials held in vaults by processors, have been part of payments for years.
But version 2.0 of the EMVCo’s Payment Tokenization Specification, announced last month, is out to change that. Call it an upgrade, perhaps, as it focuses on eCommerce and is geared toward reducing fraud associated with primary account numbers (PANs), Rambus’ CTO Chakib Bouda explained in the latest Topic TBD.
The rise of Scan and Go technology and how it works
The way that consumers shop in-store is fundamentally changing. The rise of ‘Scan and Go’ technology, coupled with other industry developments, is helping retailers to overhaul the buying experience that they offer their customers. So, what do retailers need to know about Scan and Go, and what are its benefits?
Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14™ ASIC Platform for Data Center and Enterprise
Suite of silicon-proven PHYs on 14nm LPP process technology maximize performance and flexibility
SUNNYVALE, Calif. – Oct. 12, 2017 – Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform. Built on the GLOBALFOUNDRIES’ 14nm FinFET (14LPP) process technology, the Rambus SerDes PHYs are optimized for power and area at peak bandwidth, generating Ethernet speeds up to 100Gb and beyond for high-speed wireline, wireless, 5G network infrastructure, high-performance servers, storage, connectivity and compute applications.
“Data traffic and bandwidth demands have exploded, driving the insatiable need for highly optimized, high-performance semiconductor solutions,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “Through our collaboration with GLOBALFOUNDRIES, Rambus is delivering robust high-speed interface IP that enables innovative chips and systems designed specifically for the Data Center and Communications markets and helping GLOBALFOUNDRIES deliver value to its customers through tested solutions.”
“Next-generation systems for cloud and communications must deliver more performance and handle more complexity than ever before,” said Kevin O’Buckley, vice president of product development at GLOBALFOUNDRIES. “Working together with Rambus enables us to provide ASIC solutions to our customers with a range of high-speed SerDes interfaces that have been optimized for power and area at peak bandwidth while maintaining complete compatibility with industry standards.”
The Rambus SerDes PHYs include a Physical Media Attachment (PMA) hard macro and Physical Coding Sub-layer with Built-in Self-Test (PCS-BIST) soft macro. The PHYs can also be configured to multiple channel widths and packaging options, which simplifies integration and maximizes design flexibility.
For additional information on Rambus SerDes Interface Solutions, please visit rambus.com/serdes.
Is banking transformation leaving consumers behind?
New research from omni-channel solutions firm, NCR Corporation, has found that UK consumers have high expectations of their financial institutions, and that there is room for improvement from banks seeking to meet those growing standards.
Functional Safety Issues Rising
Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security.
