Rambus Blog
GLOBALFOUNDRIES highlights HBM2 PHY collaboration with Rambus
2Tbps multi-lane HBM2 PHY Earlier this month, GLOBALFOUNDRIES demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm
Wireless VR to strain data networks
Juniper Research analysts forecast that wireless VR headsets (smartphone-based and standalone) data consumption will increase by over 650% over the
SiFive and Rambus to provide IP for the ‘DesignShare’ economy
SiFive has announced a collaborative partnership with Rambus. More specifically, the latter company’s security technology will be made available for
How NVDIMM-N enables higher system performance
Sarvagya Kochak, a senior product marketing manager at Rambus, recently penned an article for Semiconductor Engineering that explores the concept
5G edge computing in a post-GIGO world
There are many who would dispute the notion that we are living in a post-GIGO (Garbage In, Garbage Out) world.
Can the IoT be immunized?
The Financial Times recently published an article that explores the dangers of an unsecured IoT ecosystem. As the article notes, human
GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solution
GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for
Worldwide semiconductor capital spending to increase over 10% in 2017
Gartner analysts say worldwide semiconductor capital spending will hit $77.7 billion in 2017, posting an impressive 10.2% increase. According to
U.S. Senate legislation seeks to bolster federal IoT security
U.S. Sens. Mark R. Warner (D-VA) and Cory Gardner (R-CO), co-chairs of the Senate Cybersecurity Caucus, along with Sens. Ron
Memory and the IoT
Semiconductor Engineering’s Ed Sperling and Jeff Dorsch recently wrote an article about the challenges of chip design in the age
British police official eyes security ratings for IoT-connected devices
A British police official has suggested that televisions, fridges and other internet-connected home appliances should carry a cyber security score
HBM2 continues to ramp
Samsung ramps volume production of 8GB HBM2 Earlier this month, Samsung confirmed an increase in production volume of its 8-gigabyte
Softbank Technology announces strategic IoT security partnership with Rambus
Softbank Technology, along with two of its subsidiaries, Cybertrust Japan and Miracle Linux Corporation, have announced a strategic partnership with
Devil’s Ivy haunts vulnerable IoT devices
Security researchers at Senrio have discovered a stack buffer overflow vulnerability (CVE-2017-9765) in the M3004 Axis Communications security camera. Dubbed
FBI expresses concern over Internet-connected toys
Privacy and safety risks The Federal Bureau of Investigation (FBI) has issued a public service announcement that encourages consumers to
Memory buffer chips: The Amdahl-Moore’s Law connection
John Eble, a senior director of technical product marketing at Rambus, recently penned an article for Semiconductor Engineering about memory
Part 2: DRAM goes cryogenic
In part one of this series, Rambus Chief Scientist Craig Hampel told Semiconductor Engineering’s Ed Sperling that cryogenic DRAM (below
Encouraging IoT security adoption
Rambus Sr. Director of Security Products Asaf Ashkenazi recently wrote an article for Semiconductor Engineering about encouraging IoT security adoption.
Part 1: DRAM goes cryogenic
Rambus Chief Scientist Craig Hampel recently spoke with Ed Sperling of Semiconductor Engineering about the power benefits and performance advantages
Becoming a design-led CMO
Drew Neisser of AdAge recently spoke with Rambus CMO Jerome Nadel about the importance of adopting a design-led approach to
We need to talk about IoT security
Earlier this month, Sophos global head of security research James Lyne told ITProPortal that now is the time for tough,