Rambus Blog
Rambus cracks post-quantum ‘QcBits’ cipher with side-channel power analysis
Rambus security researchers have successfully conducted a side-channel assisted cryptanalysis attack against QcBits, a code-based public key algorithm based on
EE Times says DDR5 is running in Rambus’ labs
Rick Merritt of the EE Times reports that Rambus has working silicon in its labs for DDR5, which the journalist
Rambus highlights HBM2 PHY collaboration at GLOBALFOUNDRIES Technology Conference
HBM2 PHY We are showcasing our HBM2 PHY at the GLOBALFOUNDRIES Technology Conference at the Hyatt Regency Santa Clara (table
Next-gen server DIMM buffer chipset targets DDR5 memory
Rambus has announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype
The challenges of IP reuse
Semiconductor Engineering’s Ed Sperling recently penned an article about the challenges of IP reuse. The basic business proposition for third-party
Rambus showcases IoT security, mobile payments and smart ticketing @ MWCA 2017
We will be showcasing our IoT security, mobile payment and smart ticketing solutions at Mobile World Congress Americas (MWCA 2017)
Understanding the growing threat of medical cyberattacks
Depending on what you read or who you talk to, medical devices, along with hospital networks, fall into two categories:
5G connections to hit 1.4 billion by 2025
Juniper Research analysts are forecasting 1.4 billion 5G connections by 2025, an increase from just 1 million – upon commercial
TEMPEST side-channel attacks recover AES-256 encryption keys
In a recently published paper, security researchers built a miniature system capable of covertly recovering encryption keys using side-channel analysis.
Part 2: When design thinking is CMO thinking
Earlier this month, Rambus CMO Jerome Nadel appeared on the “Renegade Thinkers Unite” podcast hosted by Drew Neisser to discuss
Part 1: When design thinking is CMO thinking
Rambus CMO Jerome Nadel recently appeared on the “Renegade Thinkers Unite” podcast hosted by Drew Neisser to discuss the importance
Rambus and Northwest Logic certify HBM2 interoperability
Rambus has validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The combined HBM2 solution is
Bolstering bandwidth and capacity with new memory tech
Rambus’ John Eble and Frank Ferro recently penned an article for Data Center Dynamics that explores how new memory technology
GLOBALFOUNDRIES highlights HBM2 PHY collaboration with Rambus
2Tbps multi-lane HBM2 PHY Earlier this month, GLOBALFOUNDRIES demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm
Wireless VR to strain data networks
Juniper Research analysts forecast that wireless VR headsets (smartphone-based and standalone) data consumption will increase by over 650% over the
SiFive and Rambus to provide IP for the ‘DesignShare’ economy
SiFive has announced a collaborative partnership with Rambus. More specifically, the latter company’s security technology will be made available for
How NVDIMM-N enables higher system performance
Sarvagya Kochak, a senior product marketing manager at Rambus, recently penned an article for Semiconductor Engineering that explores the concept
5G edge computing in a post-GIGO world
There are many who would dispute the notion that we are living in a post-GIGO (Garbage In, Garbage Out) world.
Can the IoT be immunized?
The Financial Times recently published an article that explores the dangers of an unsecured IoT ecosystem. As the article notes, human
GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solution
GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for
Worldwide semiconductor capital spending to increase over 10% in 2017
Gartner analysts say worldwide semiconductor capital spending will hit $77.7 billion in 2017, posting an impressive 10.2% increase. According to