Rambus inks security licensing agreement with Idaho Scientific

Rambus has signed an agreement with Idaho Scientific to license its Differential Power Analysis (DPA) countermeasures. According to Dr. Martin Scott, general manager of Rambus’s Security Division, the DPA countermeasures will be used in Idaho Scientific’s FPGA and defense ASIC security IP Cores.

“Today’s leading aerospace and defense companies are looking for solutions to counter the increasing threat of side-channel attacks,” said Scott. “This licensing agreement will grant Idaho Scientific’s customers access to advanced DPA countermeasures – allowing them to safeguard the data integrity of applications requiring a high level of security, particularly those serving the aerospace and defense sectors.”

Computer Business Review highlights side-channel threat

Alexander Sword of Computer Business Review says cyber security is often thought of as a software issue that can be solved with a software solution. However, this paradigm ignores hardware-based attacks, a type of cyber threat security providers are now taking quite seriously.

“There are still plenty of unsecured chips out there, vulnerable to several major types of hardware attack,” he explained. “These include side-channel attacks, which are techniques that allow attackers to monitor the analogue characteristics and interface connections and any electromagnetic radiation.”

Rambus Signs License Agreement with Idaho Scientific

DPA countermeasures to strengthen the security of Idaho Scientific anti-tamper solutions

SUNNYVALE, Calif. – August 9, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed an agreement with Idaho Scientific, LLC to license its Differential Power Analysis (DPA) countermeasures for use in Idaho Scientific’s security IP Cores for FPGAs and defense ASICs. Through this agreement, Idaho Scientific’s customers, which include many of the world’s largest defense contractors, will gain access to advanced DPA countermeasures, safeguarding the data integrity of applications requiring a high level of security.

“By incorporating Rambus’ technology into our IP cores, we provide our customers access to premier solutions that are immune to DPA attacks,” said Dale Reese, president of Idaho Scientific. “The Rambus DPA countermeasures enhance the efficiencies of our FPGA and ASIC encryption cores, which are especially critical to our aerospace and defense customers.”

DPA countermeasures, developed by Rambus Cryptography Research, consist of a broad range of software, hardware, and protocol techniques that protect devices from side-channel attacks. DPA is a type of side-channel attack that monitors variations in the electrical power consumption or electro-magnetic emissions from a target device. These measurements can then be used to obtain cryptographic keys and other sensitive information from semiconductors.

“Today’s leading aerospace and defense companies are looking for solutions to counter the increasing threat of side-channel attacks,” said Dr. Martin Scott, general manager of the Rambus Security Division. “Broader and faster adoption of DPA countermeasures in the FPGA ecosystem will ensure that components are insulated from these types of vulnerabilities. Idaho Scientific has the ability to rapidly deliver solutions based on our DPA countermeasures that will bring significant benefits to the industries they serve, where safety and security are a top priority.”

About Rambus Security Division

The Rambus Security Division is dedicated to providing a secure foundation for a connected world. Integrating technologies from Cryptography Research, Bell ID and Ecebs, our innovative solutions span areas including tamper resistance, content and media protection, network security, mobile payment, smart ticketing, and trusted transaction services. Our technologies protect nearly nine billion licensed products annually, providing secure access to data and creating an economy of digital trust between our customers and their customer base. Additional information is available at rambus.com/security.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, software, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

About Idaho Scientific, LLC.

Idaho Scientific is a provider of security, cryptography, and anti-tamper IP cores to many of the world’s largest defense contractors. The threats facing our nations tactical and critical infrastructure evolve rapidly. To combat these threats, Idaho Scientific’s maintains cutting edge research through internal and government sponsored programs. The technologies developed under these efforts are matured, tested, and deployed within our nation’s most critical systems. In addition to IP offerings, Idaho Scientific provides anti-tamper and cyber security engineering services. As subject matter experts, Idaho Scientific works with customers to evaluate system vulnerabilities, design countermeasures, and deploy solutions. For more information, visit www.idahoscientific.com.

From chip to cloud to client device

Over the past few years, Rambus has evolved from a pure IP licensing business to a product-centric semiconductor company. Our diverse product portfolio currently includes memory and interfaces, along with security and smart sensor solutions.

The recent acquisition of Bell ID, along with its products, personnel and technologies, represents a strategic addition to our security division. Now an integral part of Rambus, Bell ID continues to help banks, governments and enterprises issue and manage credentials on smartphones, smart cards and connected devices. As an established leader in host card emulation (HCE), we are deployed worldwide and support all major cloud-based mobile payment platforms.

Rambus Completes Acquisition of Snowbush IP Assets

SUNNYVALE, Calif. – August 8, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced it has successfully completed the acquisition of the assets of Semtech’s Snowbush IP. The closing purchase price totaled $32 million, including additional payments based upon specific new product sales through the end of 2022.

As announced in June, Rambus plans to integrate the Snowbush IP assets into its Memory and Interfaces Division to bolster its SerDes and IP offerings, addressing critical needs of the server, networking and data center market.

To learn more about Rambus and the Memory and Interfaces division, visit rambus.com/memory-and-interfaces.

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About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Note Regarding Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 as amended, including statements regarding the potential benefits and incorporation of the acquired technologies into the Rambus Memory and Interfaces division, expected addition to pro forma earnings within 18-24 months, growth opportunities of the SerDes market, and the ability to bolster the Rambus IP and product offerings. These forward-looking statements are based on current expectations, estimates, assumptions and projections that are subject to change. Actual results may differ materially from the forward-looking statements due to a variety of factors including, but not limited to, risks and uncertainties described from time to time in Rambus’ annual report on Form 10-K, quarterly reports on Forms 10-Q and other periodic filings with the Securities and Exchange Commission. All forward-looking statements are made as of the date of this press release and Rambus does not undertake any obligation to update any forward-looking statements based on new developments or changes in expectations.

Understanding Dennard scaling

In 1974, Robert H. Dennard co-authored a now-famous paper for the IEEE Journal of Solid State Circuits. Essentially, Dennard and his engineering colleagues observed that as transistors are reduced in size, their power density stays constant. Meaning, power use stays in proportion with area, as both voltage and current scale (downward) with length.

According to Prof. Dr.-Ing. Christian Märtin Hochschule of the Faculty of Computer Science at Augsburg University of Applied Sciences, power in CMOS chips can be modeled as dscaling. Q is the number of transistors, f the operating frequency of the chip, C the capacitance, V the operating voltage and I, the leakage current.