Steven Woo, VP of Solutions Marketing at Rambus, recently participated in an Internet of Things (IoT) Summit panel discussion about the creation of new monetization opportunities in the burgeoning space. As Woo noted, chip design projects that once cost a few tens of millions of dollars a decade ago have jumped to $200 million or more. In addition, a significant increase in the number of IP blocks, use cases and configurations have created complex schedule risks and logistics challenges for chipmakers.
New monetization opportunities for the IoT
Semiconductor (silicon) IP market to hit $7 billion by 2022
A new report by MarketsandMarkets projects that the semiconductor (silicon) IP space will be worth $7.01 billion in 2022, up from $3.09 billion in 2015. “The driving factors for the growth of this market include increasing demand for advanced SoCs in the consumer sector, increased funding from governments and investors, emerging IoT ecosystem, recovering automotive sector and growing popularity of miniaturized devices,” MarketsandMarkets researchers explained in a recently published report summary.
Controllers Newsletter – Q1 2016
CSI-2 Controller Core V2 Now Available
Northwest Logic has released its second generation CSI-2 Controller Core V2. This core utilizes a 64-bit core width to support the fastest D-PHY and C-PHY data rates available now and anticipated in the future at controller clock frequencies which are easy to close timing. This core fully supports the MIPI D-PHY 1.2/2.0 (up to 8 lanes) and C-PHY 1.0/1.1 standards (up to 4 trios). Leveraging over 6 years of MIPI experience, this second generation core provides the same easy-to-use, silicon-proven functionality of the first generation core with lower latency and lower power. For more information, contact Northwest Logic.
Live HBM/2.5D Seminar, March 9, 2016 in Mountain View, CA
SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High-Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect an SoC and an HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This seminar will present a complete HBM supply chain that is delivering and supporting customer HBM/2.5D designs now.
Wednesday, March 9, 2016
4:00-7:00 PM Pacific time
Computer History Museum
Mountain View, California
Learn More Register
FIDUS/Inrevium MIPI D-PHY Board Available
FIDUS’s Meticom-based, dual-MIPI FMC Board supports two MIPI D-PHY interfaces (1 Tx and 1 Rx). Each of these interfaces can be used for 1-4 lane CSI-2 or DSI operation. This MIPI FMC card connects with a large number of Inrevium and other vendors’ FMC-compatible FPGA baseboards. This board enables system designs which interface to CSI-2 image sensors or DSI displays to be quickly created. Northwest Logic’s CSI-2 and DSI Controller Cores fully support this board. To view a demonstration of a MIPI reference design which includes Northwest Logic’s cores, click on this link: YouTube. Contact Fidus or Northwest Logic for more information.
Northwest Logic and Toshiba are collaborating to expand capabilities for the Toshiba FFSA™ and ASIC platforms
Northwest Logic and Toshiba have combined efforts to provide a complete, high-performance DDR and PCIe integrated solution for Toshiba’s custom LSIs including the Toshiba Fit Fast Structured Array (FFSA™) and ASIC platforms. This complete offering consists of Northwest Logic’s DDRx controllers and PCI Express cores fully integrated and verified with Toshiba DDR and PCIe PHYs. These solutions are available now and are being implemented by our first customer through this joint effort. “Through our collaboration with Northwest Logic, we are able to offer robust pre-verified PHY/controller sub-systems increasing the added value and reducing customer time to market,” said Doug Day, vice president Engineering Design Solution Group, Toshiba America Electronic Components, Inc. Please contact Northwest Logic for more information.
Rambus and Northwest Logic PCIe ASIC solution
Northwest Logic’s Express 3.0 Core has been fully integrated and validated with the Rambus R+ Multi-protocol PHY for PCIe at a leading-edge foundry. This complete solution is silicon-proven in a 28nm testchip which will be used for PCIe-SIG certification. “As SoC design complexity continues to increase, this integrated offering provides an easy-to-use, comprehensive solution for PCIe 3.0 Endpoint applications,” said Khalid Ansari, VP, High-Speed Interface Marketing at Rambus. “We look forward to continuing our partnership with Northwest Logic as we continue to design and deliver high-quality solutions for our customers.” For more information contact Northwest Logic or Rambus.
Northwest Logic Launches Its New and Improved Website
Visit the new and improved website at www.nwlogic.com
Northwest Logic Adds New Asia-Pacific Sales Reps
Northwest Logic has brought on the following sales reps to further expand our Asia-Pacific presence:
Apston and Soar Solutions are supporting Northwest Logic solutions in South Korea. 2APAC are supporting Northwest Logic solutions in China and Taiwan
We look forward to serving our customer needs in in the Asia-Pacific with the assistance of these companies.
From Silicon Valley to Egypt National Science Week
The Egypt National Science Week is a nationwide celebration to promote science and technology throughout the country, comprising numerous lectures, panel discussions, science demonstrations, robot competitions, cultural events and more, held at universities in major cities all over Egypt. More than 12,000 people, mostly students, registered to participate and over 1500 attended the opening events on March 12 at the Week’s hub, the American University in Cairo.
SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems Announce “Start your HBM/2.5D Design Today” Webinar
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Webinar will bring content from recent seminar to a worldwide audience
San Jose, California — March 15, 2016 — SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems recently presented a live seminar in the Bay Area discussing High Bandwidth Memory (HBM) designs implemented with 2.5D technology. The event was very well received, with over 100 people in attendance. The five companies are now bringing this HBM information to a worldwide audience with two webinars on Tuesday, March 29, 2016. The two live webinar events will occur at 8:00 AM and 6:00 PM Pacific Daylight Time.
HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This webinar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now.
Webinar attendees will also receive an informative white paper on HBM design.
This webinar has now concluded.
About SK hynix.
SK hynix, headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.
About Amkor Technology Inc.
Amkor Technology is one of the world’s largest providers of semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information visit www.amkor.com.
About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com. The right chip. Right now™
About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit www.nwlogic.com or contact us directly.
About Avery Design Systems
Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of formal analysis applications for RT-level and gate-level X verification; robust core-through-chip-level Verification IP for PCI Express, USB, AMBA, UFS, MIPI, DDR/LPDDR, HBM, HMC, ONFI/Toggle, NVM Express, SCSI Express, SATA Express, eMMC, SD/SDIO, and CAN FD standards. The company is a member of the Mentor Graphics Value Added Partnership (VAP) program and has established numerous Avery Design VIP partner program affiliations with leading IP suppliers. More information about the company may be found at www.avery-design.com.
| Contacts: | ||
| Kevin Tran SK hynix America. 408-232-8386 [email protected] |
Debi Polo Amkor Technology, Inc. 480-786-7653 [email protected] |
Sally Slemons eSilicon Corporation 408-635-6409 [email protected] |
| Brian Daellenbach Northwest Logic 503-533-5800 x309 [email protected] |
Chris Browy Avery Design Systems 978-851-3627 [email protected] |
Rambus inks security license agreement with Altis Semiconductor
Rambus’ Cryptography Research division has signed a licensing agreement with Altis Semiconductor for the use of advanced security technologies. The agreement includes differential power analysis (DPA) countermeasure techniques, which are designed to protect against DPA and other side-channel attacks.
